Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on test wafers that include multiple means/steps for enabling NC detection of V0 via opens

ABSTRACT

Improved processes for manufacturing semiconductor wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configured to target/expose a variety of open-circuit, short-circuit, leakage, and/or excessive resistance failure modes. Such processes include evaluating one or more Designs of Experiments (“DOEs”), each comprised of multiple NCEM-enabled fill cells, in at least two variants, targeted to the same failure mode. Such DOEs include multiple means/steps for enabling non-contact (NC) detection of V0 via opens.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.15/090,256, entitled “Integrated Circuit Containing DOEs of NCEM-enabledFill Cells,” filed Apr. 4, 2016, by applicant PDF Solutions, Inc., which'256 application is incorporated by reference herein.

This application is also a continuation of U.S. patent application Ser.No. 15/090,267, entitled “Process for Making Semiconductor Dies, Chips,and Wafers Using In-Line Measurements Obtained From DOEs of NCEM-enabledFill Cells,” filed Apr. 4, 2016, by applicant PDF Solutions, Inc., which'267 application is incorporated by reference herein.

This application is also a continuation of U.S. patent application Ser.No. 15/090,274, entitled “Mesh-Style NCEM Pads, and Process for MakingSemiconductor Dies, Chips, and Wafers Using In-Line Measurements fromSuch Pads,” filed Apr. 4, 2016, by applicant PDF Solutions, Inc., which'274 application is incorporated by reference herein.

This application also claims priority from U.S. Pat. Applic. Ser. No.62/268,463, entitled “Integrated Circuit Containing DOEs of NCEM-enabledFill Cells+Process for Making Semiconductor Dies, Chips, and WafersUsing In-Line Measurements Obtained From DOEs of NCEM-enabled FillCells,” filed Dec. 16, 2015, which '463 application is incorporated byreference herein.

Mask Work Notice

A portion of the disclosure of this patent document (including itsincorporated documents) contains material which is subject to mask workprotection, *M*, PDF Solutions, Inc. The mask work owner (PDF Solutions,Inc.) has no objection to the facsimile reproduction by anyone of thepatent document (including its incorporated documents) or the patentdisclosure, as it appears in the Patent and Trademark Office patent fileor records, but otherwise reserves all mask work rights whatsoever.

FIELD OF THE INVENTION

This invention relates generally to improved processes for manufacturingsemiconductor wafers and chips through use of in-line measurementsobtained via non-contact electrical measurements (“NCEM”), to on-chipstructures configured to provide useful information via NCEM, and toimplementation of NCEM structures in library compatible fill cells.

BACKGROUND OF THE INVENTION

U.S. Pat. No. 5,008,727 (“Standard cell having test pad for probing andsemiconductor integrated circuit device containing the standard cells”)to Katsura et al., incorporated by reference herein, discloses placementof a testing pad in a standard cell.

U.S. Pat. No. 6,091,249 A (“Method and apparatus for detecting defectsin wafers”) to Graham et al., incorporated by reference herein,discloses structures and methods for testing certain defects using anon-contact (“NC”) technique.

U.S. Pat. No. 6,452,412 B1 (“Drop-in test structure and methodology forcharacterizing an integrated circuit process flow and topography”) toJarvis et al., incorporated by reference herein, discloses structuresand methods for testing certain defects using an NC technique.

U.S. Pat. No. 6,949,765 B2 (“Padless structure design for easyidentification of bridging defects in lines by passive voltagecontrast”) to Song et al., incorporated by reference herein, disclosesstructures and methods for testing certain defects using an NCtechnique.

U.S. Pat. No. 7,101,722 B1 (“In-line voltage contrast determination oftunnel oxide weakness in integrated circuit technology development”) toWang et al., incorporated by reference herein, discloses structures andmethods for testing certain defects using an NC technique.

U.S. Pat. No. 7,105,436 B2 (“Method for in-line monitoring ofvia/contact holes etch process based on test structures in semiconductorwafer manufacturing”) to Zhao et al., incorporated by reference herein,discloses structures and methods for testing certain defects using an NCtechnique.

U.S. Pat. No. 7,518,190 B2 (“Grounding front-end-of-line structures on aSOI substrate”) to Cote et al., incorporated by reference herein,discloses structures and methods for testing certain defects using an NCtechnique.

U.S. Pat. No. 7,930,660 B2 (“Measurement structure in a standard cellfor controlling process parameters during manufacturing of an integratedcircuit”), to Ruderer et al., incorporated by reference herein,describes the use of test structures in fill cells for manufacturingoptimization.

U.S. Pat. No. 7,939,348 B2 (“E-beam inspection structure for leakageanalysis”), to Seng et al., incorporated by reference herein, disclosesstructures and methods for testing certain defects using an NCtechnique.

U.S. Pat. No. 8,039,837 B2 (“In-line voltage contrast detection of PFETsilicide encroachment”) to Patterson et al., incorporated by referenceherein, discloses structures and methods for testing certain defectsusing an NC technique.

U.S. Pat. No. 8,339,449 B2 (“Defect monitoring in semiconductor devicefabrication”), to Fong et al., incorporated by reference herein,discloses structures and methods for testing certain defects using an NCtechnique.

U.S. Pat. No. 8,399,266 B2 (“Test structure for detection of gap inconductive layer of multilayer gate stack”) to Mo et al., incorporatedby reference herein, discloses structures and methods for testingcertain defects using an NC technique.

U.S. Pat. No. 8,421,009 B2 (“Test structure for charged particle beaminspection and method for defect determination using the same”) to Xiao,incorporated by reference herein, discloses structures and methods fortesting certain defects using an NC technique.

U.S. Pat. No. 8,575,955 B1 (“Apparatus and method for electricaldetection and localization of shorts in metal interconnect lines”) toBrozek, incorporated by reference herein, discloses structures andmethods for testing certain defects using an NC technique.

U.S. Patent Publication 20090102501 A1 (“Test structures for e-beamtesting of systematic and random defects in integrated circuits”) toGuldi et al., incorporated by reference herein, discloses structures andmethods for testing certain defects using an NC technique.

SUMMARY OF THE INVENTION

The invention generally involves the placement of NC-testablestructures, and DOEs (Designs of Experiments) based on such structures,preferably within the “fill cells” typically used in standard cell logicregions. As used in this application, “fill cells” (or “filler cells”)refer to cells configured for placement in standard cell rows, but notconfigured to perform any logical or information storage function(s).Modern, standard-cell layouts commonly use such fill cells to relieverouting congestion. See, e.g., Cong, J., et al. “Optimizing routabilityin large-scale mixed-size placement,” ASP-DAC, 2013; and Menezes, C., etal. “Design of regular layouts to improve predictability,” Proceedingsof the 6th IEEE International Caribbean Conference on Devices, Circuitsand Systems, 2006. See also U.S. Pat. No. 8,504,969 (“Filler Cells forDesign Optimization in a Place-and-Route System”) to Lin et al.,incorporated by reference herein. As used herein “fill cells” mayinclude structures designed to perform ancillary (i.e., not logical orstorage) functions, for example, well ties and/or decoupling capacitors.

One NC measurement technique, useful in connection with certainembodiments of the invention, involves measuring or inspecting thesurface of a partially processed wafer (in-line) with a scanningelectron microscope (“SEM”) or other charged particle-basedscanning/imaging device. As the measuring/inspecting proceeds, the SEM(or other device) induces charge on all electrically floating elements,whereas any grounded elements remain at zero potential. This voltagecontrast becomes visible to the scanning/imaging device as a NCEM.

This NC measurement technique, commonly known as “voltage contrastinspection,” has been used in the semiconductor industry for many years,see, e.g., U.S. Pat. No. 6,344,750 B1 (“Voltage contrast method forsemiconductor inspection using low voltage particle beam”), and existsin many different flavors—as demonstrated by the dozens of subsequentpatents that cite the '750 patent as prior art.

U.S. patent application Ser. No. 14/612,841 (“Opportunistic placement ofIC test structures and/or e-beam target pads in areas otherwise used forfiller cells, tap cells, decap cells, scribe lines, and/or dummy fill,as well as product IC chips containing same”), filed Feb. 3, 2015, byinventors De et al., incorporated by reference herein, and owned by theassignee of the present application, discloses a number of highlyefficient—and herein preferred—methods for obtaining NCEMs from theNCEM-enabled test structures utilized in the present invention. Whilethese '841 methods represent the applicant's preferred NC measurementmethods, it is applicant's intent that usage of the terms “NCmeasurement” or “NCEM” in this application should not be limited tothese preferred methods in the absence of specific language (e.g.,“selectively targeting . . . ”, “ . . . fewer than 10 pixels”) thatindicates an intent to so limit a claim.

In general usage, the term Design of Experiments (DOE) or ExperimentalDesign refers to the design of any information-gathering exercise wherevariation is present, whether under the full control of the experimenteror not.

Experimental Design is an established field, well known to personsskilled in the art. See NIST/SEMATECH e-Handbook of Statistical Methods,http://www.itl.nist.gov/div898/handbook/, updated Oct. 30, 2013,incorporated by reference herein.

As will be apparent to the skilled reader, the typical DOE hereinrelates to an experiment involving one or more semiconductor die(s)and/or wafer(s), wherein said one or more die(s) and/or wafer(s) containmultiple instances of a substantially similar test structure, at leastsome of which vary in terms of one or more layout-related parameters(including, but not limited to, size, spacing, offset, overlap, width,extension, run length, periodicity, density, neighborhood patterning,including underlayers) or process related parameters (including, but notlimited to, dose, rate, exposure, processing time, temperature, or anytool-specifiable setting). As the person skilled in the art knows, theselection of specific parameter(s) to vary, the amount/distribution oftheir variation, and the number and location of test structures thatexpress such variation will be selected based upon the goals of theexperiment, the involved process, and the availability of appropriateplaces (e.g., fill cell locations, tap cell locations, decap celllocations, scribe line areas, etc.) to instantiate the test structures.

Preferred embodiments of the invention utilize DOEs constructed fromNCEM-enabled fill cells. In accordance with certain preferredembodiments of the invention, NCEM-enabled fill cells all have somecommon elements (e.g., height, supply rail configuration, and gatepatterning that is consistent with standard cells in the library), thenvary according to the measurement type (e.g., short, open, leakage, orresistance), layer(s) involved, and/or structure(s) to beevaluated/tested. Such NCEM-enabled fill cells also generally include apad, configured to accelerate targeted NC evaluation by, for example,determining an associated NCEM from a small number of enlarged pixels(e.g., 10 or fewer), or without creating any image at all. Such pads canbe formed from a variety of low-resistance materials and configured in avariety of shapes.

In certain preferred embodiments, such NCEM-enabled fill cells mayadditionally include two or more mask-patterned features that define arectangular test area, such test area being characterized by twoparameters (e.g., X/Y or r/θ dimensions). Additionally, for suchNCEM-enabled fill cells, an expanded test area surrounds the cell's testarea, the expanded test area being defined by a predetermined expansionof each boundary of the test area, or by predetermined proportionateexpansion of the test area's area. Alternatively, in the case of cellsdesigned to measure or characterize inter-layer effects, such test areasmay be characterized as “test volumes,” with one or more additionalparameter(s) characterizing the layers of the defining, mask-patternedfeatures.

For fill cells designed to measure, detect, or characterize electricalshort circuit behavior (so-called, “short-configured, NCEM-enabled fillcells”), the test area may represent an intended gap between twopattern-defined features that, in the absence of a manufacturinganomaly, would be electrically isolated. Alternatively, in suchshort-configured, NCEM-enabled fill cells, the test area may representan overlap between two pattern-defined features that, in the absence ofa manufacturing anomaly, would be electrically isolated. A singleshort-configured, NCEM-enabled fill cell may contain one or multipletest areas. In the case of a NCEM-enabled fill cell with multiple testareas, each of the cell's test areas is preferably wired in parallel,and each of the cell's test areas (and preferably each of its extendedtest areas, too) is identically or nearly identically configured.

Fill cells designed to measure, detect, or characterize electricalleakage behavior (so-called, “leakage-configured, NCEM-enabled fillcells”) typically resemble short-configured cells. Like theshort-configured cells, such leakage-configured cells may include a testarea that represents an intended gap between two pattern-definedfeatures that, in ideality, should be electrically isolated, but inreality, inevitably exhibit some amount of leakage. Alternatively, insuch leakage-configured, NCEM-enabled fill cells, the test area mayrepresent an overlap between two pattern-defined features that, inideality, would be electrically isolated, but in reality, inevitablyexhibit some amount of leakage. A single leakage-configured,NCEM-enabled fill cell may contain one, but preferably contains multipletest areas. In the case of a cell with multiple test areas, each of thecell's test areas is preferably wired in parallel, and each of thecell's test areas (and preferably each of its extended test areas, too)is identically or nearly identically configured.

For fill cells designed to measure, detect, or characterize electricalopen circuit behavior (so-called, “open-configured, NCEM-enabled fillcells”), the test area typically represents an intended overlap, orextension, between two pattern-defined features that, in the absence ofa manufacturing anomaly, would be electrically connected. (It may alsorepresent a single-layer pattern, such as a snake.) A singleopen-configured, NCEM-enabled fill cell may contain one or multiple testareas. In the case of multiple test areas, each of the cell's test areasis preferably connected in series, and each of the cell's test areas(and preferably each of the extended test areas, too) is identically ornearly identically configured.

Fill cells designed to measure, detect, or characterize electricalresistance behavior (so-called, “resistance-configured, NCEM-enabledfill cells”) typically resemble open-configured cells. Like theopen-configured cells, such resistance-configured cells may include atest area that represents an intended overlap, or extension, between twopattern-defined features that, in ideality, would be connected by anearly zero-resistance path, but in reality, inevitably produce ameasurable level of resistance. (Such test area may also represent asingle-layer pattern, such as a snake.) A single resistance-configured,NCEM-enabled fill cell may contain one, but preferably contains multipletest areas. In the case of multiple test areas, each of the cell's testareas is preferably connected in series, and each of the cell's testareas (and preferably each of the extended test areas, too) isidentically or nearly identically configured.

DOEs, in accordance with such preferred embodiments, comprise acollection of substantially similarly configured NCEM-enabled fillcells, in a plurality of variants. Within a given DOE, such similarlyconfigured fill cells would typically all be configured to measure,detect, or characterize the same behavior (e.g., gate-to-gate, orcontrol-element-to-control-element, shorts, for example), in the samestructural configuration (e.g., tip-to-tip, as per FIG. 14, forexample). In single-parameter DOEs, the differences between variants maybe limited to differences in the size, shape, or position of one of thefeatures that defines the cells' test area. In multi-parameter DOEs, thedifferences between variants may involve differences in two or more suchparameters. And in more complex DOEs, the differences may involve othernon-incremental changes (e.g., the presence or absence of certainfeatures, or changes in nearby or underlying patterning), either aloneor in combination with additional to single- or multi-parametervariations.

In the case of DOEs involving complex changes to nearby patterning,changes that lie within an expanded test area (an area that encompassesa predetermined expansion of the test area by, for example 50-200%, ormore) and involve either the test area-defining layer(s) or any layersthat overlap or lie immediately above or below the test area-defininglayers, are preferably limited in number. Limiting the number of suchchanges to fewer than three, five, ten, twenty, or thirty “backgroundpattern variants” facilitates analysis of data that the experimentproduces.

Another way to characterize the degree of relevant patterning variationbetween DOE variants—in certain embodiments of the invention—involvesthe concept of a pattern similarity ratio (“PSR”), whose computation ispictorially depicted in FIGS. 37-40 (and described later herein). Inaccordance with this aspect of the invention, for each variant in a DOE,there should exist another variant in the DOE that has a PSR of at least0.90 (or preferably 0.95, or more preferably 0.97) for every test-areadefining layer, and at least 0.75 (or preferably 0.85, or morepreferably 0.90) for each layer that lies immediately below any of thetest-area defining layer(s), when the expanded test areas are defined tobe at least 150-200% of the corresponding test area sizes.

Another aspect of DOEs, in accordance with the preferred embodiments, isthat they include multiple instances (e.g., 3, 5, 10, 20, 500, 100, 200,or 500+) of each NCEM-enabled fill cell variant. Furthermore, suchvariants are preferably distributed, either regularly or irregularly,throughout the space available for instantiation of fill cells.

Accordingly, generally speaking, and without intending to be limiting,one aspect of the invention relates to ICs that include, for example: astandard cell area that includes a mix of at least one thousand logiccells and fill cells of different widths and uniform heights, placedinto at least twenty adjacent rows, with at least twenty cells placedside-by-side in each row; wherein the integrated circuit includes atleast a first DOE, the first DOE comprising a plurality ofsimilarly-configured, NCEM-enabled fill cells, wherein each NCEM-enabledfill cell comprises at least: first and second elongated conductivesupply rails, formed in a connector or interconnect stack, extendingacross the entire width of the cell, and configured for compatibilitywith corresponding supply rails contained in the logic cells of thestandard cell region; a NCEM pad, formed in a conductive layer, the padbeing at least two times larger, in at least one dimension, than aminimum size permitted by design rules; a rectangular test area definedby selected boundaries of at least first and second distinct,mask-patterned features, the test area being characterized by twodimensional parameters; a first conductive pathway that electricallyconnects the first mask-patterned feature to the pad; and, a secondconductive pathway that electrically connects the second mask-patternedfeature to a permanently or virtually grounded structure; wherein eachof the similarly-configured, NCEM-enabled fill cells in the first DOE isconfigured to render a first selected manufacturing failure observableas an abnormal pad-to-ground leakage or conductance, detected by VCinspection of the pad; and, wherein the similarly-configured,NCEM-enabled fill cells of the first DOE include a plurality ofvariants, where the variants differ in terms of their respectiveprobability of presenting an abnormal pad-to-ground leakage orresistance as a result of the first selected manufacturing failure. SuchICs may further include: a second DOE, comprising a plurality ofsimilarly-configured, NCEM-enabled fill cells, wherein each NCEM-enabledfill cell comprises at least: first and second elongated conductivesupply rails, formed in a connector or interconnect stack, extendingacross the entire width of the cell, and configured for compatibilitywith corresponding supply rails contained in the logic cells of thestandard cell region; a NCEM pad, formed in a conductive layer, the padbeing at least two times larger, in at least one dimension, than aminimum size permitted by design rules; a rectangular test area definedby selected boundaries of at least first and second distinct,mask-patterned features, the test area being characterized by twodimensional parameters; a first conductive pathway that electricallyconnects the first mask-patterned feature to the pad; and, a secondconductive pathway that electrically connects the second mask-patternedfeature to a permanently or virtually grounded structure; wherein eachof the similarly-configured, NCEM-enabled fill cells in the second DOEis configured to render a second selected manufacturing failureobservable as an abnormal pad-to-ground leakage or conductance, detectedby VC inspection of the pad, and wherein the second selectedmanufacturing failure is different than the first selected manufacturingfailure; and, wherein the similarly-configured, NCEM-enabled fill cellsof the second DOE include a plurality of variants, where the variantsdiffer in terms of their respective probability of presenting anabnormal pad-to-ground leakage or conductance as a result of the secondselected manufacturing failure. The first selected manufacturing failuremay involve short or leakage defects that present as abnormally highpad-to-ground conductance or leakage, and the second selectedmanufacturing failure may involve open or resistance defects thatpresent as abnormally low pad-to-ground conductance or abnormally highpad-to-ground resistance. Both the first and second selectedmanufacturing failures may involve layers in a connector stack region ofthe IC. Such ICs may further include: a third DOE, comprising aplurality of similarly-configured, NCEM-enabled fill cells, wherein eachNCEM-enabled fill cell comprises at least: first and second elongatedconductive supply rails, formed in a connector or interconnect stack,extending across the entire width of the cell, and configured forcompatibility with corresponding supply rails contained in the logiccells of the standard cell region; a NCEM pad, formed in a conductivelayer, the pad being at least two times larger, in at least onedimension, than a minimum size permitted by design rules; a rectangulartest area defined by selected boundaries of at least first and seconddistinct, mask-patterned features, the test area being characterized bytwo dimensional parameters; a first conductive pathway that electricallyconnects the first mask-patterned feature to the pad; and, a secondconductive pathway that electrically connects the second mask-patternedfeature to a permanently or virtually grounded structure; wherein eachof the similarly-configured NCEM-enabled fill cells in the third DOE isconfigured to render a third selected manufacturing failure observableas an abnormal pad-to-ground leakage, conductance or resistance,detected by VC inspection of the pad, and wherein the third selectedmanufacturing failure is different than the first selected manufacturingfailure, and is different than the second selected manufacturingfailure; and, wherein the similarly-configured NCEM-enabled fill cellsof the third DOE include a plurality of variants, where the variantsdiffer in terms of their respective probability of presenting anabnormal pad-to-ground leakage, conductance or resistance as a result ofthe third selected manufacturing failure. Each of the first, second, andthird DOEs preferably include NCEM-enabled fill cells in at least three,five, seven, or ten variants. The NCEM-enabled fill cells of the first,second, and third DOEs are preferably irregularly distributed within thestandard cell area of the IC. Each variant may differ from the other(s)only in the position, size, or shape of its first or secondmask-patterned feature, or only by a single dimensional parameter thatcharacterizes their respective test areas.

Again, generally speaking, and without intending to be limiting, anotheraspect of the invention relates to ICs that include, for example: astandard cell area that includes a mix of at least one thousand logiccells and fill cells of different widths and uniform heights, placedinto at least twenty adjacent rows, with at least twenty cells placedside-by-side in each row; wherein the IC includes at least a first DOE,the first DOE comprising a plurality of similarly-configured,NCEM-enabled fill cells, wherein each NCEM-enabled fill cell comprisesat least: first and second elongated conductive supply rails, formed ina connector or interconnect stack, extending across the entire width ofthe cell, and configured for compatibility with corresponding supplyrails contained in the logic cells of the standard cell region; a NCEMpad, formed in a conductive layer, the pad being at least two timeslarger, in at least one dimension, than a minimum size permitted bydesign rules; a rectangular test area defined by selected boundaries offirst and second distinct, mask-patterned features, the test areacharacterized by two dimensional parameters, the test area configured toprovide electrical isolation between the first and second mask-patternedfeatures in the absence of a first selected manufacturing failure; afirst conductive pathway that electrically connects the firstmask-patterned feature to the pad; and, a second conductive pathway thatelectrically connects the second mask-patterned feature to a permanentlyor virtually grounded structure; wherein each of thesimilarly-configured, NCEM-enabled fill cells in the first DOE isconfigured to render a first selected manufacturing failure observableas an abnormally high pad-to-ground conductance or leakage, detected byVC inspection of the pad; and, wherein the similarly-configured,NCEM-enabled fill cells of the first DOE include a plurality ofvariants, where the variants differ in terms of their respectiveprobability of presenting an abnormally high pad-to-ground conductanceor leakage as a result of the first selected manufacturing failure. Ineach of the NCEM-enabled fill cells of the first DOE, the first and/orsecond distinct, mask-patterned features may each represent either acontrol element, or a portion thereof, and/or a portion of a controlelement connector or a substrate connector, and/or a portion of acontrol element jumper, substrate jumper, or interconnect jumper. Ineach of the NCEM-enabled fill cells of the first and/or second DOE(s),the first and second distinct, mask-patterned features may appear in atip-to-tip configuration, a tip-to-side configuration, a side-to-sideconfiguration, a diagonal configuration, or an interlayer overlapconfiguration.

Again, generally speaking, and without intending to be limiting, anotheraspect of the invention relates to ICs that include, for example: astandard cell area that includes a mix of at least one thousand logiccells and fill cells of different widths and uniform heights, placedinto at least twenty adjacent rows, with at least twenty cells placedside-by-side in each row; wherein the IC includes at least a first DOE,the first DOE comprising a plurality of similarly-configured,NCEM-enabled fill cells, wherein each NCEM-enabled fill cell comprisesat least: first and second elongated conductive supply rails, formed ina connector or interconnect stack, extending across the entire width ofthe cell, and configured for compatibility with corresponding supplyrails contained in the logic cells of the standard cell region; a NCEMpad, formed in one or more conductive layer(s), the pad being at leasttwo times larger, in at least one dimension, than a minimum sizepermitted by design rules; a rectangular test area defined by selectedboundaries of a plurality of mask-patterned features, the test areacharacterized by two dimensional parameters, the plurality ofmask-patterned features including at least first and second featuresthat are electrically connected in the absence of a first manufacturingfailure; a first conductive pathway that electrically connects the firstmask-patterned feature to the pad; and, a second conductive pathway thatelectrically connects the second mask-patterned feature to a permanentlyor virtually grounded structure; wherein each of thesimilarly-configured NCEM-enabled fill cells in the first DOE isconfigured to render a first selected manufacturing failure observableas an abnormally high pad-to-ground conductance or leakage, detected byVC inspection of the pad; wherein the similarly-configured NCEM-enabledfill cells of the first DOE include a plurality of variants, where thevariants differ in terms of their respective probability of presentingan abnormally high pad-to-ground conductance or leakage as a result ofthe first selected manufacturing failure; and, wherein thesimilarly-configured NCEM-enabled fill cells of the first DOE areselected from the list consisting of: AA-tip-to-tip-short-configured,NCEM-enabled fill cells; AACNT-tip-to-tip-short-configured, NCEM-enabledfill cells; AACNT-AA-tip-to-tip-short-configured, NCEM-enabled fillcells; TS-tip-to-tip-short-configured, NCEM-enabled fill cells;GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V0-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-tip-short-configured, NCEM-enabled fill cells;AA-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATE-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;TS-GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;M1-tip-to-side-short-configured, NCEM-enabled fill cells;V0-tip-to-side-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-side-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-side-short-configured, NCEM-enabled fill cells;V1-tip-to-side-short-configured, NCEM-enabled fill cells;M2-tip-to-side-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-side-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-tip-to-side-short-configured, NCEM-enabled fill cells;V2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-side-short-configured, NCEM-enabled fill cells;AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;TS-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-side-to-side-short-configured, NCEM-enabled fill cells;M1-side-to-side-short-configured, NCEM-enabled fill cells;V0-side-to-side-short-configured, NCEM-enabled fill cells;M1-V0-side-to-side-short-configured, NCEM-enabled fill cells;V1-M1-side-to-side-short-configured, NCEM-enabled fill cells;V1-side-to-side-short-configured, NCEM-enabled fill cells;M2-side-to-side-short-configured, NCEM-enabled fill cells;M2-V1-side-to-side-short-configured, NCEM-enabled fill cells;V2-M2-side-to-side-short-configured, NCEM-enabled fill cells;M3-side-to-side-short-configured, NCEM-enabled fill cells;V2-side-to-side-short-configured, NCEM-enabled fill cells;M3-V2-side-to-side-short-configured, NCEM-enabled fill cells;AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-TS-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATECNT-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AACNT-L-shape-interlayer-short-configured, NCEM-enabledfill cells; V0-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-V2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; AA-diagonal-short-configured, NCEM-enabled fill cells;TS-diagonal-short-configured, NCEM-enabled fill cells;AACNT-diagonal-short-configured, NCEM-enabled fill cells;AACNT-AA-diagonal-short-configured, NCEM-enabled fill cells;GATE-diagonal-short-configured, NCEM-enabled fill cells;GATE-AACNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-GATE-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-diagonal-short-configured, NCEM-enabled fill cells;M1-diagonal-short-configured, NCEM-enabled fill cells;V0-diagonal-short-configured, NCEM-enabled fill cells;M1-V0-diagonal-short-configured, NCEM-enabled fill cells;V1-M1-diagonal-short-configured, NCEM-enabled fill cells;V1-diagonal-short-configured, NCEM-enabled fill cells;M2-diagonal-short-configured, NCEM-enabled fill cells;M2-V1-diagonal-short-configured, NCEM-enabled fill cells;M3-diagonal-short-configured, NCEM-enabled fill cells;V2-M2-diagonal-short-configured, NCEM-enabled fill cells;V2-diagonal-short-configured, NCEM-enabled fill cells;M3-V2-diagonal-short-configured, NCEM-enabled fill cells;AA-corner-short-configured, NCEM-enabled fill cells;AACNT-corner-short-configured, NCEM-enabled fill cells;AACNT-AA-corner-short-configured, NCEM-enabled fill cells;GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-TS-corner-short-configured, NCEM-enabled fill cells;GATECNT-corner-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-corner-short-configured, NCEM-enabled fill cells;M1-corner-short-configured, NCEM-enabled fill cells;V0-corner-short-configured, NCEM-enabled fill cells;M1-V0-corner-short-configured, NCEM-enabled fill cells;V1-M1-corner-short-configured, NCEM-enabled fill cells;V1-corner-short-configured, NCEM-enabled fill cells;M2-corner-short-configured, NCEM-enabled fill cells;M2-V1-corner-short-configured, NCEM-enabled fill cells;M3-corner-short-configured, NCEM-enabled fill cells;V2-M2-corner-short-configured, NCEM-enabled fill cells;V2-corner-short-configured, NCEM-enabled fill cells;M3-V2-corner-short-configured, NCEM-enabled fill cells;GATE-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATE-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-GATECNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V1-V0-interlayer-overlap-short-configured, NCEM-enabled fill cells;M2-M1-interlayer-overlap-short-configured, NCEM-enabled fill cells;V2-V1-interlayer-overlap-short-configured, NCEM-enabled fill cells;M3-M2-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATECNT-via-chamfer-short-configured, NCEM-enabled fill cells;V0-AACNT-via-chamfer-short-configured, NCEM-enabled fill cells;V1-M1-via-chamfer-short-configured, NCEM-enabled fill cells;V2-M2-via-chamfer-short-configured, NCEM-enabled fill cells;V0-merged-via-short-configured, NCEM-enabled fill cells;V1-merged-via-short-configured, NCEM-enabled fill cells; and,V2-merged-via-short-configured, NCEM-enabled fill cells; a second DOE,comprising a plurality of similarly-configured, NCEM-enabled fill cells,wherein each NCEM-enabled fill cell comprises at least: first and secondelongated conductive supply rails, formed in a connector or interconnectstack, extending across the entire width of the cell, and configured forcompatibility with corresponding supply rails contained in the logiccells of the standard cell region; a NCEM pad, formed in a conductivelayer, the pad being at least two times larger, in at least onedimension, than a minimum size permitted by design rules; a rectangulartest area defined by selected boundaries of at least first and seconddistinct, mask-patterned features, the test area being characterized bytwo dimensional parameters; a first conductive pathway that electricallyconnects the first mask-patterned feature to the pad; and, a secondconductive pathway that electrically connects the second mask-patternedfeature to a permanently or virtually grounded structure; wherein eachof the similarly-configured, NCEM-enabled fill cells in the second DOEis configured to render a second selected manufacturing failureobservable as an abnormally low pad-to-ground conductance or abnormallyhigh pad-to-ground resistance, detected by VC inspection of the pad;and, wherein the similarly-configured, NCEM-enabled fill cells of thesecond DOE include a plurality of variants, where the variants differ interms of their respective probability of presenting an abnormally lowpad-to-ground conductance or abnormally high pad-to-ground resistance asa result of the second selected manufacturing failure; and, wherein thesimilarly-configured NCEM-enabled fill cells of the second DOE areselected from the list consisting of: AA-snake-open-configured,NCEM-enabled fill cells; TS-snake-open-configured, NCEM-enabled fillcells; AACNT-snake-open-configured, NCEM-enabled fill cells;GATE-snake-open-configured, NCEM-enabled fill cells;GATECNT-snake-open-configured, NCEM-enabled fill cells;V0-snake-open-configured, NCEM-enabled fill cells;M1-snake-open-configured, NCEM-enabled fill cells;V1-snake-open-configured, NCEM-enabled fill cells;M2-snake-open-configured, NCEM-enabled fill cells;V2-snake-open-configured, NCEM-enabled fill cells;M3-snake-open-configured, NCEM-enabled fill cells;AA-stitch-open-configured, NCEM-enabled fill cells;TS-stitch-open-configured, NCEM-enabled fill cells;AACNT-stitch-open-configured, NCEM-enabled fill cells;GATECNT-stitch-open-configured, NCEM-enabled fill cells;V0-stitch-open-configured, NCEM-enabled fill cells;M1-stitch-open-configured, NCEM-enabled fill cells;V1-stitch-open-configured, NCEM-enabled fill cells;M2-stitch-open-configured, NCEM-enabled fill cells;V2-stitch-open-configured, NCEM-enabled fill cells;M3-stitch-open-configured, NCEM-enabled fill cells;AACNT-TS-via-open-configured, NCEM-enabled fill cells;AACNT-AA-via-open-configured, NCEM-enabled fill cells;TS-AA-via-open-configured, NCEM-enabled fill cells;GATECNT-GATE-via-open, NCEM-enabled fill cells;V0-GATECNT-via-open-configured, NCEM-enabled fill cells;V0-AA-via-open-configured, NCEM-enabled fill cells;V0-TS-via-open-configured, NCEM-enabled fill cells;V0-AACNT-via-open-configured, NCEM-enabled fill cells;V0-GATE-via-open-configured, NCEM-enabled fill cells;V0-via-open-configured, NCEM-enabled fill cells;M1-V0-via-open-configured, NCEM-enabled fill cells;V1-M1-via-open-configured, NCEM-enabled fill cells;V1-M2-via-open-configured, NCEM-enabled fill cells;M1-GATECNT-via-open-configured, NCEM-enabled fill cells;M1-AANCT-via-open-configured, NCEM-enabled fill cells;V2-M2-via-open-configured, NCEM-enabled fill cells;M3-V2-via-open-configured, NCEM-enabled fill cells;M1-metal-island-open-configured, NCEM-enabled fill cells;M2-metal-island-open-configured, NCEM-enabled fill cells;M3-metal-island-open-configured, NCEM-enabled fill cells;V0-merged-via-open-configured, NCEM-enabled fill cells;V0-AACNT-merged-via-open-configured, NCEM-enabled fill cells;V0-GATECNT-merged-via-open-configured, NCEM-enabled fill cells;V1-merged-via-open-configured, NCEM-enabled fill cells;V2-merged-via-open-configured, NCEM-enabled fill cells;V1-M1-merged-via-open-configured, NCEM-enabled fill cells;V2-M2-merged-via-open-configured, NCEM-enabled fill cells.

Again, generally speaking, and without intending to be limiting, anotheraspect of the invention relates methods for making ICs that include, forexample: (a) performing initial processing steps on a semiconductorwafer, the initial processing steps including: patterning a standardcell area that includes a mix of at least one thousand logic cells andfill cells of different widths and uniform heights, placed into at leasttwenty adjacent rows, with at least twenty cells placed side-by-side ineach row; and, patterning a first DOE by instantiating a plurality ofsimilarly-configured, NCEM-enabled fill cells in at least two variants,the NCEM-enabled fill cells configured for compatibility with logiccells in the standard cell area, each of the cells in the first DOEconfigured to enable evaluation of a first manufacturing failure byvoltage contrast examination of a NCEM of a pad contained in the cell,the variants exhibiting different NCEM sensitivity to the firstmanufacturing failure; (b) determining a presence or absence of thefirst manufacturing failure by: performing a voltage contrastexamination of NCEM-enabled fill cells in the first DOE; and,determining whether NCEMs of pads contained in the NCEM-enabled fillcells of the first DOE represent instance(s) of the first manufacturingfailure and, if so, determining whether different cell variants exhibita different prevalence of the first manufacturing failure; and, (c)based, at least in part, on results from step (b), selectivelyperforming additional processing, metrology or inspection steps on thewafer, and/or on other wafer(s) currently being manufactured using aprocess flow(s) relevant to the observed first manufacturing failure.Step (a) may further involve: patterning a second DOE by instantiating aplurality of similarly-configured NCEM-enabled fill cells in at leasttwo variants, the NCEM-enabled fill cells configured for compatibilitywith logic cells in the standard cell area and fill cells in the firstDOE, each of the cells in the second DOE configured to enable evaluationof a second manufacturing failure, different from the firstmanufacturing failure, by voltage contrast examination of a NCEM of apad contained in the cell, the variants exhibiting different NCEMsensitivity to the second manufacturing failure; and wherein step (b)further comprises: performing a voltage contrast examination ofNCEM-enabled fill cells in the second DOE; and, determining whetherNCEMs of pads contained in the NCEM-enabled fill cells of the second DOErepresent instance(s) of the second manufacturing failure and, if so,determining whether different cell variants exhibit a differentprevalence of the second manufacturing failure. Step (a) may furtherinvolve: patterning a third DOE by instantiating a plurality ofsimilarly-configured NCEM-enabled fill cells in at least two variants,the NCEM-enabled fill cells configured for compatibility with logiccells in the standard cell area and fill cells in the first and secondDOEs, each of the cells in the third DOE configured to enable evaluationof a third manufacturing failure, different from the first and secondmanufacturing failures, by voltage contrast examination of a NCEM of apad contained in the cell, the variants exhibiting different NCEMsensitivity to the third manufacturing failure; and wherein step (b)further comprises: performing a voltage contrast examination ofNCEM-enabled fill cells in the third DOE; and, determining whether NCEMsof pads contained in the NCEM-enabled fill cells of the third DOErepresent instance(s) of the third manufacturing failure and, if so,determining whether different cell variants exhibit a differentprevalence of the third manufacturing failure. At least one of thefirst, second, or third manufacturing failures preferably involvesunintended shorts or leakages, and at least one of the first, second, orthird manufacturing failures preferably involves unintended opens orexcessive resistances. Instantiating the NCEM-enabled fill cellspreferably comprises distributing the cells irregularly within thestandard cell area. Within each of the DOEs, each variant may differfrom the other(s) only in the position, size, or shape of a singlemask-patterned feature. At least one of the first, second, or thirdmanufacturing failures may involve unintended shorts between structuresin a tip-to-tip configuration, or unintended shorts between structuresin a tip-to-side configuration, or unintended shorts between structuresin a side-to-side configuration, or unintended shorts between structuresin a diagonal configuration, or unintended shorts between structures inan interlayer overlap configuration, or unintended interlayer shorts orleakages between structures in a corner configuration, unintended opensin snake-shaped structures, unintended opens in stitched structures,unintended opens in via-connected structures. Each of the first, second,and third DOEs preferably includes NCEM-enabled fill cells in at leastthree, five, seven, 11, 21, or more variants. Each of the first, second,and third DOEs may consist of cells selected from the list of:AA-tip-to-tip-short-configured, NCEM-enabled fill cells;AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells;AACNT-AA-tip-to-tip-short-configured, NCEM-enabled fill cells;TS-tip-to-tip-short-configured, NCEM-enabled fill cells;GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V0-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-tip-short-configured, NCEM-enabled fill cells;AA-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATE-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;TS-GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;M1-tip-to-side-short-configured, NCEM-enabled fill cells;V0-tip-to-side-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-side-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-side-short-configured, NCEM-enabled fill cells;V1-tip-to-side-short-configured, NCEM-enabled fill cells;M2-tip-to-side-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-side-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-tip-to-side-short-configured, NCEM-enabled fill cells;V2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-side-short-configured, NCEM-enabled fill cells;AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;TS-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-side-to-side-short-configured, NCEM-enabled fill cells;M1-side-to-side-short-configured, NCEM-enabled fill cells;V0-side-to-side-short-configured, NCEM-enabled fill cells;M1-V0-side-to-side-short-configured, NCEM-enabled fill cells;V1-M1-side-to-side-short-configured, NCEM-enabled fill cells;V1-side-to-side-short-configured, NCEM-enabled fill cells;M2-side-to-side-short-configured, NCEM-enabled fill cells;M2-V1-side-to-side-short-configured, NCEM-enabled fill cells;V2-M2-side-to-side-short-configured, NCEM-enabled fill cells;M3-side-to-side-short-configured, NCEM-enabled fill cells;V2-side-to-side-short-configured, NCEM-enabled fill cells;M3-V2-side-to-side-short-configured, NCEM-enabled fill cells;AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-TS-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATECNT-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AACNT-L-shape-interlayer-short-configured, NCEM-enabledfill cells; V0-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-V2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; AA-diagonal-short-configured, NCEM-enabled fill cells;TS-diagonal-short-configured, NCEM-enabled fill cells;AACNT-diagonal-short-configured, NCEM-enabled fill cells;AACNT-AA-diagonal-short-configured, NCEM-enabled fill cells;GATE-diagonal-short-configured, NCEM-enabled fill cells;GATE-AACNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-GATE-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-diagonal-short-configured, NCEM-enabled fill cells;M1-diagonal-short-configured, NCEM-enabled fill cells;V0-diagonal-short-configured, NCEM-enabled fill cells;M1-V0-diagonal-short-configured, NCEM-enabled fill cells;V1-M1-diagonal-short-configured, NCEM-enabled fill cells;V1-diagonal-short-configured, NCEM-enabled fill cells;M2-diagonal-short-configured, NCEM-enabled fill cells;M2-V1-diagonal-short-configured, NCEM-enabled fill cells;M3-diagonal-short-configured, NCEM-enabled fill cells;V2-M2-diagonal-short-configured, NCEM-enabled fill cells;V2-diagonal-short-configured, NCEM-enabled fill cells;M3-V2-diagonal-short-configured, NCEM-enabled fill cells;AA-corner-short-configured, NCEM-enabled fill cells;AACNT-corner-short-configured, NCEM-enabled fill cells;AACNT-AA-corner-short-configured, NCEM-enabled fill cells;GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-TS-corner-short-configured, NCEM-enabled fill cells;GATECNT-corner-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-corner-short-configured, NCEM-enabled fill cells;M1-corner-short-configured, NCEM-enabled fill cells;V0-corner-short-configured, NCEM-enabled fill cells;M1-V0-corner-short-configured, NCEM-enabled fill cells;V1-M1-corner-short-configured, NCEM-enabled fill cells;V1-corner-short-configured, NCEM-enabled fill cells;M2-corner-short-configured, NCEM-enabled fill cells;M2-V1-corner-short-configured, NCEM-enabled fill cells;M3-corner-short-configured, NCEM-enabled fill cells;V2-M2-corner-short-configured, NCEM-enabled fill cells;V2-corner-short-configured, NCEM-enabled fill cells;M3-V2-corner-short-configured, NCEM-enabled fill cells;GATE-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATE-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-GATECNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V1-V0-interlayer-overlap-short-configured, NCEM-enabled fill cells;M2-M1-interlayer-overlap-short-configured, NCEM-enabled fill cells;V2-V1-interlayer-overlap-short-configured, NCEM-enabled fill cells;M3-M2-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATECNT-via-chamfer-short-configured, NCEM-enabled fill cells;V0-AACNT-via-chamfer-short-configured, NCEM-enabled fill cells;V1-M1-via-chamfer-short-configured, NCEM-enabled fill cells;V2-M2-via-chamfer-short-configured, NCEM-enabled fill cells;V0-merged-via-short-configured, NCEM-enabled fill cells;V1-merged-via-short-configured, NCEM-enabled fill cells;V2-merged-via-short-configured, NCEM-enabled fill cells;AA-snake-open-configured, NCEM-enabled fill cells;TS-snake-open-configured, NCEM-enabled fill cells;AACNT-snake-open-configured, NCEM-enabled fill cells;GATE-snake-open-configured, NCEM-enabled fill cells;GATECNT-snake-open-configured, NCEM-enabled fill cells;V0-snake-open-configured, NCEM-enabled fill cells;M1-snake-open-configured, NCEM-enabled fill cells;V1-snake-open-configured, NCEM-enabled fill cells;M2-snake-open-configured, NCEM-enabled fill cells;V2-snake-open-configured, NCEM-enabled fill cells;M3-snake-open-configured, NCEM-enabled fill cells;AA-stitch-open-configured, NCEM-enabled fill cells;TS-stitch-open-configured, NCEM-enabled fill cells;AACNT-stitch-open-configured, NCEM-enabled fill cells;GATECNT-stitch-open-configured, NCEM-enabled fill cells;V0-stitch-open-configured, NCEM-enabled fill cells;M1-stitch-open-configured, NCEM-enabled fill cells;V1-stitch-open-configured, NCEM-enabled fill cells;M2-stitch-open-configured, NCEM-enabled fill cells;V2-stitch-open-configured, NCEM-enabled fill cells;M3-stitch-open-configured, NCEM-enabled fill cells;AACNT-TS-via-open-configured, NCEM-enabled fill cells;AACNT-AA-via-open-configured, NCEM-enabled fill cells;TS-AA-via-open-configured, NCEM-enabled fill cells;GATECNT-GATE-via-open, NCEM-enabled fill cells;V0-GATECNT-via-open-configured, NCEM-enabled fill cells;V0-AA-via-open-configured, NCEM-enabled fill cells;V0-TS-via-open-configured, NCEM-enabled fill cells;V0-AACNT-via-open-configured, NCEM-enabled fill cells;V0-GATE-via-open-configured, NCEM-enabled fill cells;V0-via-open-configured, NCEM-enabled fill cells;M1-V0-via-open-configured, NCEM-enabled fill cells;V1-M1-via-open-configured, NCEM-enabled fill cells;V1-M2-via-open-configured, NCEM-enabled fill cells;M1-GATECNT-via-open-configured, NCEM-enabled fill cells;M1-AANCT-via-open-configured, NCEM-enabled fill cells;V2-M2-via-open-configured, NCEM-enabled fill cells;M3-V2-via-open-configured, NCEM-enabled fill cells;M1-metal-island-open-configured, NCEM-enabled fill cells;M2-metal-island-open-configured, NCEM-enabled fill cells;M3-metal-island-open-configured, NCEM-enabled fill cells;V0-merged-via-open-configured, NCEM-enabled fill cells;V0-AACNT-merged-via-open-configured, NCEM-enabled fill cells;V0-GATECNT-merged-via-open-configured, NCEM-enabled fill cells;V1-merged-via-open-configured, NCEM-enabled fill cells;V2-merged-via-open-configured, NCEM-enabled fill cells;V1-M1-merged-via-open-configured, NCEM-enabled fill cells;V2-M2-merged-via-open-configured, NCEM-enabled fill cells.

Again, generally speaking, and without intending to be limiting, anotheraspect of the invention relates to methods for making ICs that include,for example: (a) performing initial processing steps on a firstsemiconductor wafer, the initial processing steps including, at least:patterning a first DOE by instantiating a plurality ofsimilarly-configured NCEM-enabled fill cells in at least two variants,the NCEM-enabled fill cells configured for compatibility with logiccells in the standard cell library, each of the cells in the first DOEconfigured to enable evaluation of a first manufacturing failure byvoltage contrast examination of a NCEM of a pad contained in the cell,the variants exhibiting different NCEM sensitivity to the firstmanufacturing failure; patterning a second DOE by instantiating aplurality of similarly-configured NCEM-enabled fill cells in at leasttwo variants, the NCEM-enabled fill cells configured for compatibilitywith logic cells in the standard cell library and fill cells in thefirst DOE, each of the cells in the second DOE configured to enableevaluation of a second manufacturing failure, different from the firstmanufacturing failure, by voltage contrast examination of a NCEM of apad contained in the cell, the variants exhibiting different NCEMsensitivity to the second manufacturing failure; and, patterning a thirdDOE by instantiating a plurality of similarly-configured NCEM-enabledfill cells in at least two variants, the NCEM-enabled fill cellsconfigured for compatibility with logic cells in the standard celllibrary and fill cells in the first and second DOEs, each of the cellsin the third DOE configured to enable evaluation of a thirdmanufacturing failure, different from the first and second manufacturingfailures, by voltage contrast examination of a NCEM of a pad containedin the cell, the variants exhibiting different NCEM sensitivity to thethird manufacturing failure; and, (b) determining a presence or absenceof the first, second, and third manufacturing failures by: performing avoltage contrast examination of NCEM-enabled fill cells in the firstDOE; determining whether NCEMs of pads contained in the NCEM-enabledfill cells of the first DOE represent instance(s) of the firstmanufacturing failure and, if so, determining whether different cellvariants exhibit a different prevalence of the first manufacturingfailure; performing a voltage contrast examination of NCEM-enabled fillcells in the second DOE; determining whether NCEMs of pads contained inthe NCEM-enabled fill cells of the second DOE represent instance(s) ofthe second manufacturing failure and, if so, determining whetherdifferent cell variants exhibit a different prevalence of the secondmanufacturing failure; performing a voltage contrast examination ofNCEM-enabled fill cells in the third DOE; and, determining whether NCEMsof pads contained in the NCEM-enabled fill cells of the third DOErepresent instance(s) of the third manufacturing failure and, if so,determining whether different cell variants exhibit a differentprevalence of the third manufacturing failure; and, (c) based, at leastin part, on results from step (b), fabricating product masks thatinclude: a standard cell area that includes a mix of at least onethousand logic cells, from the standard cell library, and fill cells ofdifferent widths and uniform heights, placed into at least twentyadjacent rows, with at least twenty cells placed side-by-side in eachrow; and, a fourth DOE that includes a plurality of similarly-configuredNCEM-enabled fill cells in at least two variants, the NCEM-enabled fillcells configured for compatibility with logic cells in the standard cellarea, each of the cells in the fourth DOE configured to enableevaluation of the first manufacturing failure by voltage contrastexamination of a NCEM of a pad contained in the cell, the variantsexhibiting different NCEM sensitivity to the first manufacturingfailure; and, the product masks not including any DOEs configured toenable evaluation of the second or third manufacturing failures; and,(d) using the product masks, performing initial processing steps on aproduct wafer, the initial processing steps including: patterning thestandard cell area; and, patterning the fourth DOE; (e) determining apresence or absence of the first manufacturing failure on the productwafer by: performing a voltage contrast examination of NCEM-enabled fillcells in the fourth DOE; and, determining whether NCEMs of padscontained in the NCEM-enabled fill cells of the fourth DOE representinstance(s) of the first manufacturing failure and, if so, determiningwhether different cell variants exhibit a different prevalence of thefirst manufacturing failure; and, (f) based, at least in part, onresults from step (e), selectively performing additional processing,metrology or inspection steps on the product wafer, and/or on otherproduct wafer(s) currently being manufactured using a process flow(s)relevant to the observed first manufacturing failure.

Again, generally speaking, and without intending to be limiting, anotheraspect of the invention relates to methods for making ICs that include,for example: (a) performing initial processing steps on an initialproduct wafer, the initial processing steps including, at least:patterning a standard cell area that includes a mix of at least onethousand logic cells and fill cells of different widths and uniformheights, placed into at least twenty adjacent rows, with at least twentycells placed side-by-side in each row; and, patterning, within thestandard cell area, a first DOE by instantiating a plurality ofsimilarly-configured NCEM-enabled fill cells in at least two variants,the NCEM-enabled fill cells configured for compatibility with logiccells in the standard cell area, each of the cells in the first DOEconfigured to enable evaluation of a first manufacturing failure byvoltage contrast examination of a NCEM of a pad contained in the cell,the variants exhibiting different NCEM sensitivity to the firstmanufacturing failure; patterning a second DOE by instantiating aplurality of similarly-configured NCEM-enabled fill cells in at leasttwo variants, the NCEM-enabled fill cells configured for compatibilitywith logic cells in the standard cell area and fill cells in the firstDOE, each of the cells in the second DOE configured to enable evaluationof a second manufacturing failure, different from the firstmanufacturing failure, by voltage contrast examination of a NCEM of apad contained in the cell, the variants exhibiting different NCEMsensitivity to the second manufacturing failure; and, (b) determining apresence or absence of the first and second manufacturing failures onthe initial product wafer by: performing a voltage contrast examinationof NCEM-enabled fill cells in the first DOE; determining whether NCEMsof pads contained in the NCEM-enabled fill cells of the first DOErepresent instance(s) of the first manufacturing failure and, if so,determining whether different cell variants exhibit a differentprevalence of the first manufacturing failure; performing a voltagecontrast examination of NCEM-enabled fill cells in the second DOE; and,determining whether NCEMs of pads contained in the NCEM-enabled fillcells of the second DOE represent instance(s) of the secondmanufacturing failure and, if so, determining whether different cellvariants exhibit a different prevalence of the second manufacturingfailure; and, (c) based, at least in part, on results from step (b),fabricating final product masks that include: a standard cell area thatincludes a mix of at least one thousand logic cells and fill cells ofdifferent widths and uniform heights, placed into at least twentyadjacent rows, with at least twenty cells placed side-by-side in eachrow; and, a third DOE that includes a plurality of similarly-configuredNCEM-enabled fill cells in at least two variants, the NCEM-enabled fillcells configured for compatibility with logic cells in the standard cellarea, each of the cells in the third DOE configured to enable evaluationof the first manufacturing failure by voltage contrast examination of aNCEM of a pad contained in the cell, the variants exhibiting differentNCEM sensitivity to the first manufacturing failure; the final productmasks not including any DOEs configured to enable evaluation of thesecond manufacturing failure; and, (d) using the final product masks,performing initial processing steps on a final product wafer, theinitial processing steps including: patterning the standard cell area;and, patterning the third DOE; and, (e) determining a presence orabsence of the first manufacturing failure on the final product waferby: performing a voltage contrast examination of NCEM-enabled fill cellsin the third DOE; and, determining whether NCEMs of pads contained inthe NCEM-enabled fill cells of the third DOE represent instance(s) ofthe first manufacturing failure and, if so, determining whetherdifferent cell variants exhibit a different prevalence of the firstmanufacturing failure; and, (f) based, at least in part, on results fromstep (e), selectively performing additional processing, metrology orinspection steps on the final product wafer, and/or on other productwafer(s) currently being manufactured using a process flow(s) relevantto the observed first manufacturing failure.

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of tip-to-tip shorts, including but notlimited to:

-   -   means/steps for enabling NC detection of AA tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, 43, and 1298-1326 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, 43, and 1327-1405 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of TS tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA tip-to-tip        shorts [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, 43, and 1413-1461 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE tip-to-tip        shorts [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT tip-to-tip        shorts [see Parent FIGS. 10-11, 14-15, 41, 43, and 1462-1548 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT        tip-to-tip shorts [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, 43, and 1549-1556 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 tip-to-tip shorts        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of tip-to-side shorts, including but notlimited to:

-   -   means/steps for enabling NC detection of AA tip-to-side shorts        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, 43, and 45 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-AA tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, 43, 49, 50, and        1084-1119 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of TS-GATECNT tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, 43, and 1239-1263 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE        tip-to-side shorts [see Parent FIGS. 10-11, 16, 41, 43, and        1201-1238 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, 43, and 1120-1149 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT        tip-to-side shorts [see Parent FIGS. 10-11, 16, 41, 43,        1150-1188 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 tip-to-side shorts        [see Parent FIGS. 10-11, 16, 41, 43, and 1264-1297 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 tip-to-side shorts        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 tip-to-side shorts        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1 tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 tip-to-side shorts        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 tip-to-side shorts        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 tip-to-side shorts        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 tip-to-side        shorts [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of side-to-side shorts, including but notlimited to:

-   -   means/steps for enabling NC detection of AA side-to-side shorts        [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, 43, and 786-804 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, 43, and 833-859 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE        side-to-side shorts [see Parent FIGS. 10-11, 17, 41, 43, and        886-903 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, 43, and 860-872 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT        side-to-side shorts [see Parent FIGS. 10-11, 17, 41, 43, 47A-C,        and 873-885 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 side-to-side shorts        [see Parent FIGS. 10-11, 17, 41, 43, and 904-928 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 side-to-side shorts        [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, 43, and 929-936 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 side-to-side shorts        [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1 side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 side-to-side shorts        [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 side-to-side shorts        [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 side-to-side shorts        [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 side-to-side        shorts [see Parent FIGS. 10-11, 17, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of L-shape interlayer shorts, including butnot limited to:

-   -   means/steps for enabling NC detection of AA L-shape interlayer        shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA-L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-AA-L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-TS L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE-L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AA L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-TS L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT-L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AA L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-TS L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATE L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATECNT L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-AACNT L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-GATECNT L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0-L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1-L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-V0 L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1-L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-V1 L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3-M2 L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3-V2 L-shape        interlayer shorts [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of diagonal shorts, including but not limitedto:

-   -   means/steps for enabling NC detection of AA diagonal shorts [see        Parent FIGS. 10-11, 23, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of TS diagonal shorts [see        Parent FIGS. 10-11, 23, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of AACNT diagonal shorts        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA diagonal        shorts [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE diagonal shorts        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-AACNT diagonal        shorts [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE diagonal        shorts [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT diagonal shorts        [see Parent FIGS. 10-11, 23, 41, 43, and 495-554 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT diagonal        shorts [see Parent FIGS. 10-11, 23, 41, 43, and 555-632 for        corresponding §112 (f) structure/acts];    -   means/steps for enabling NC detection of M1 diagonal shorts [see        Parent FIGS. 10-11, 23, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V0 diagonal shorts [see        Parent FIGS. 10-11, 23, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M1-V0 diagonal shorts        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 diagonal shorts        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 diagonal shorts [see        Parent FIGS. 10-11, 23, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M2 diagonal shorts [see        Parent FIGS. 10-11, 23, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M2-V1 diagonal shorts        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 diagonal shorts [see        Parent FIGS. 10-11, 23, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V2-M2 diagonal shorts        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 diagonal shorts [see        Parent FIGS. 10-11, 23, 41, and 43 for corresponding §112(f)        structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 diagonal shorts        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of corner shorts, including but not limitedto:

-   -   means/steps for enabling NC detection of AA corner shorts [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of AACNT corner shorts        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA corner shorts        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE corner shorts [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE corner        shorts [see Parent FIGS. 10-11, 24-26, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-TS corner        shorts [see Parent FIGS. 10-11, 24-26, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT corner shorts        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AA corner        shorts [see Parent FIGS. 10-11, 24-26, 41, 43, and 263-286 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT corner        shorts [see Parent FIGS. 10-11, 24-26, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 corner shorts [see        Parent FIGS. 10-11, 24-26, 41, 43, and 416-494 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 corner shorts [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M1-V0 corner shorts        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 corner shorts        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 corner shorts [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M2 corner shorts [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M2-V1 corner shorts        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 corner shorts [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V2-M2 corner shorts        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 corner shorts [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 corner shorts        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of interlayer-overlap shorts, including butnot limited to:

-   -   means/steps for enabling NC detection of GATE-AA interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, 43, and 692-734        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-AACNT interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, 43, and 633-691        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-TS interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-TS interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AA interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AA interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-TS interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATE interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-GATECNT interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-AACNT interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-V0 interlayer        overlap shorts [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of        M2-M1-interlayer-overlap shorts [see Parent FIGS. 10-11, 27, 41,        and 43 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of        V2-V1-interlayer-overlap shorts [see Parent FIGS. 10-11, 27, 41,        and 43 for corresponding §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of        M3-M2-interlayer-overlap shorts [see Parent FIGS. 10-11, 27, 41,        and 43 for corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of via-chamfer shorts, including but notlimited to:

-   -   means/steps for enabling NC detection of V0-GATECNT via chamfer        shorts [see Parent FIGS. 10-11, 28, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT via chamfer        shorts [see Parent FIGS. 10-11, 28, 41, 43, and 52-256 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 via chamfer        shorts [see Parent FIGS. 10-11, 28, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 via chamfer        shorts [see Parent FIGS. 10-11, 28, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/step for enabling NC detection of V3-M3 via chamfer shorts        [see Parent FIGS. 10-11, 28, 41, 43, and 257-262 for        corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of merged-via shorts, including but notlimited to:

-   -   means/steps for enabling NC detection of V0 merged via shorts        [see Parent FIGS. 10-11, 29, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 merged via shorts        [see Parent FIGS. 10-11, 29, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of V2 merged via shorts        [see Parent FIGS. 10-11, 29, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of snake opens, including but not limited to:

-   -   means/steps for enabling NC detection of AA snake opens [see        Parent FIGS. 12-13, 30, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of TS snake opens [see        Parent FIGS. 12-13, 30, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of AACNT snake opens [see        Parent FIGS. 12-13, 30, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of GATE snake opens [see        Parent FIGS. 12-13, 30, 41, 43, and 1041-1048 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT snake opens        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 snake opens [see        Parent FIGS. 12-13, 30, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M1 snake opens [see        Parent FIGS. 12-13, 30, 41, 43, 44, and 1049-1066 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0-AACNT snake opens        [see Parent FIGS. 12-13, 30, 41, 43, and 1067-1071 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 snake opens [see        Parent FIGS. 12-13, 30, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M2 snake opens [see        Parent FIGS. 12-13, 30, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V2 snake opens [see        Parent FIGS. 12-13, 30, 41, and 43 for corresponding §112(f)        structure/acts]; and,    -   means/steps for enabling NC detection of M3 snake opens [see        Parent FIGS. 12-13, 30, 41, and 43 for corresponding §112(f)        structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of stitch opens, including but not limited to:

-   -   means/steps for enabling NC detection of AA stitch opens [see        Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of TS stitch opens [see        Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of AACNT stitch opens [see        Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of GATECNT stitch opens        [see Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 stitch opens [see        Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M1 stitch opens [see        Parent FIGS. 12-13, 31-32, 41, 43, and 1072-1083 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 stitch opens [see        Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M2 stitch opens [see        Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V2 stitch opens [see        Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding §112(f)        structure/acts]; and,    -   means/steps for enabling NC detection of M3 stitch opens [see        Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding §112(f)        structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of via opens, including but not limited to:

-   -   means/steps for enabling NC detection of AACNT-TS via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 1629-1673 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 1557-1628 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of TS-AA via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2315-2330 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE via opens        [see Parent FIGS. 12-13, 33, 41, 43, 48, and 1699-2005 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT via opens        [see Parent FIGS. 12-13, 33, 41, 43, and 1674-1682 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT-GATE via        opens [see Parent FIGS. 12-13, 33, 41, 43, and 1683-1698 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATECNT via opens        [see Parent FIGS. 12-13, 33, 41, 43, and 2375-2439 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AA via opens [see        Parent FIGS. 12-13, 33, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V0 via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2331-2344 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-TS via opens [see        Parent FIGS. 12-13, 33, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V0-AACNT via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2345-2374 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATE via opens [see        Parent FIGS. 12-13, 33, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V1 via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2440-2441 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2006-2220 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2442-2459 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M2 via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2221-2256 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-GATECNT via opens        [see Parent FIGS. 12-13, 33, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3-V2 via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2257-2274 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-AANCT via opens [see        Parent FIGS. 12-13, 33, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V2-M2 via opens [see        Parent FIGS. 12-13, 33, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection V3 via opens [see Parent        FIGS. 12-13, 33, 41, 43, and 2460-2461 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M4-V3 via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2275-2296 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M5-V4 via opens [see        Parent FIGS. 12-13, 33, 41, 43, and 2297-2314 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of metal island opens, including but notlimited to:

-   -   means/steps for enabling NC detection of M1 metal island opens        [see Parent FIGS. 12-13, 34-35, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 metal island opens        [see Parent FIGS. 12-13, 34-35, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 metal island opens        [see Parent FIGS. 12-13, 34-35, 41, and 43 for corresponding        §112(f) structure/acts];

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of merged-via opens, including but not limitedto:

-   -   means/steps for enabling NC detection of V0-GATECNT merged via        opens [see Parent FIGS. 12-13, 36, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 merged via opens        [see Parent FIGS. 12-13, 36, 41, 43, and 735-785 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT merged via        opens [see Parent FIGS. 12-13, 36, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 merged via opens        [see Parent FIGS. 12-13, 36, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 merged via opens        [see Parent FIGS. 12-13, 36, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 merged via opens        [see Parent FIGS. 12-13, 36, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of V2-M2 merged via opens        [see Parent FIGS. 12-13, 36, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of tip-to-tip leakages, including but notlimited to:

-   -   means/steps for enabling NC detection of AA tip-to-tip leakages        [see Parent FIGS. 10-11, 14-15, 41, 43, and 1298-1326 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, 43, and 1327-1405        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of TS tip-to-tip leakages        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, 43, and 1413-1461        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, 43, and 1462-1548        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT        tip-to-tip leakages [see Parent FIGS. 10-11, 14-15, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 tip-to-tip leakages        [see Parent FIGS. 10-11, 14-15, 41, 43, and 1549-1556 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 tip-to-tip leakages        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 tip-to-tip leakages        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 tip-to-tip leakages        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1 tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 tip-to-tip leakages        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 tip-to-tip leakages        [see Parent FIGS. 10-11, 14-15, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 tip-to-tip        leakages [see Parent FIGS. 10-11, 14-15, 41, and 43 for        corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of tip-to-side leakages, including but notlimited to:

-   -   means/steps for enabling NC detection of AA tip-to-side leakages        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, 43, and 45 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-AA tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, 43, 49, 50, and        1084-1119 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of TS-GATECNT tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, 43, and 1239-1263 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE        tip-to-side leakages [see Parent FIGS. 10-11, 16, 41, 43, and        1201-1238 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, 43, and 1120-1149 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT        tip-to-side leakages [see Parent FIGS. 10-11, 16, 41, 43,        1150-1188 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 tip-to-side leakages        [see Parent FIGS. 10-11, 16, 41, 43, and 1264-1297 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 tip-to-side leakages        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 tip-to-side leakages        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1 tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 tip-to-side leakages        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 tip-to-side leakages        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 tip-to-side leakages        [see Parent FIGS. 10-11, 16, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 tip-to-side        leakages [see Parent FIGS. 10-11, 16, 41, and 43 for        corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of side-to-side leakages, including but notlimited to:

-   -   means/steps for enabling NC detection of AA side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, 43, and 786-804 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, 43, and 833-859 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE        side-to-side leakages [see Parent FIGS. 10-11, 17, 41, 43, and        886-903 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, 43, and 860-872 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT        side-to-side leakages [see Parent FIGS. 10-11, 17, 41, 43,        47A-C, and 873-885 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, 43, and 904-928 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, 43, and 929-936 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 side-to-side        leakages [see Parent FIGS. 10-11, 17, 41, and 43 for        corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of L-shape interlayer leakages, including butnot limited to:

-   -   means/steps for enabling NC detection of AA L-shape interlayer        leakages [see Parent FIGS. 10-11, 18-22, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA-L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-AA-L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-TS L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE-L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AA L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-TS L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT-L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AA L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-TS L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATE L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATECNT L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-AACNT L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-GATECNT L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0-L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1-L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-V0 L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1-L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-V1 L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3-M2 L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3-V2 L-shape        interlayer leakages [see Parent FIGS. 10-11, 18-22, 41, and 43        for corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of diagonal leakages, including but notlimited to:

-   -   means/steps for enabling NC detection of AA diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of TS diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA diagonal        leakages [see Parent FIGS. 10-11, 23, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-AACNT diagonal        leakages [see Parent FIGS. 10-11, 23, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE diagonal        leakages [see Parent FIGS. 10-11, 23, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT diagonal        leakages [see Parent FIGS. 10-11, 23, 41, 43, and 495-554 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT diagonal        leakages [see Parent FIGS. 10-11, 23, 41, 43, and 555-632 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2-V1 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 diagonal leakages        [see Parent FIGS. 10-11, 23, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of corner leakages, including but not limitedto:

-   -   means/steps for enabling NC detection of AA corner leakages [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of AACNT corner leakages        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA corner        leakages [see Parent FIGS. 10-11, 24-26, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE corner leakages        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE corner        leakages [see Parent FIGS. 10-11, 24-26, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-TS corner        leakages [see Parent FIGS. 10-11, 24-26, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT corner leakages        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AA corner        leakages [see Parent FIGS. 10-11, 24-26, 41, 43, and 263-286 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT corner        leakages [see Parent FIGS. 10-11, 24-26, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 corner leakages [see        Parent FIGS. 10-11, 24-26, 41, 43, and 416-494 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 corner leakages [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M1-V0 corner leakages        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 corner leakages        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 corner leakages [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M2 corner leakages [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of M2-V1 corner leakages        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 corner leakages [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts];    -   means/steps for enabling NC detection of V2-M2 corner leakages        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 corner leakages [see        Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding §112(f)        structure/acts]; and,    -   means/steps for enabling NC detection of M3-V2 corner leakages        [see Parent FIGS. 10-11, 24-26, 41, and 43 for corresponding        §112(f) structure/acts];

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of interlayer-overlap leakages, including butnot limited to:

-   -   means/steps for enabling NC detection of GATE-AA interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, 43, and        692-734 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-AACNT interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, 43, and        633-691 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE-TS interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-TS interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AA interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AA interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-TS interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATE interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-GATECNT interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-AACNT interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-V0 interlayer        overlap leakages [see Parent FIGS. 10-11, 27, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of        M2-M1-interlayer-overlap leakages [see Parent FIGS. 10-11, 27,        41, and 43 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of        V2-V1-interlayer-overlap leakages [see Parent FIGS. 10-11, 27,        41, and 43 for corresponding §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of        M3-M2-interlayer-overlap leakages [see Parent FIGS. 10-11, 27,        41, and 43 for corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of via-chamfer leakages, including but notlimited to:

-   -   means/steps for enabling NC detection of V0-GATECNT via chamfer        leakages [see Parent FIGS. 10-11, 28, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT via chamfer        leakages [see Parent FIGS. 10-11, 28, 41, 43, and 52-256 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 via chamfer        leakages [see Parent FIGS. 10-11, 28, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 via chamfer        leakages [see Parent FIGS. 10-11, 28, 41, and 43 for        corresponding §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of V3-M3 via chamfer        leakages [see Parent FIGS. 10-11, 28, 41, 43, and 257-262 for        corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of merged-via leakages, including but notlimited to:

-   -   means/steps for enabling NC detection of V0 merged via leakages        [see Parent FIGS. 10-11, 29, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 merged via leakages        [see Parent FIGS. 10-11, 29, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of V2 merged via leakages        [see Parent FIGS. 10-11, 29, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of snake resistances, including but notlimited to:

-   -   means/steps for enabling NC detection of AA snake resistances        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of TS snake resistances        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT snake resistances        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of GATE snake resistances        [see Parent FIGS. 12-13, 30, 41, 43, and 1041-1048 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT snake        resistances [see Parent FIGS. 12-13, 30, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 snake resistances        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 snake resistances        [see Parent FIGS. 12-13, 30, 41, 43, 44, and 1049-1066 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0-AACNT snake        resistances [see Parent FIGS. 12-13, 30, 41, 43, and 1067-1071        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 snake resistances        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 snake resistances        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 snake resistances        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3 snake resistances        [see Parent FIGS. 12-13, 30, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of stitch resistances, including but notlimited to:

-   -   means/steps for enabling NC detection of AA stitch resistances        [see Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of TS stitch resistances        [see Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT stitch        resistances [see Parent FIGS. 12-13, 31-32, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT stitch        resistances [see Parent FIGS. 12-13, 31-32, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 stitch resistances        [see Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1 stitch resistances        [see Parent FIGS. 12-13, 31-32, 41, 43, and 1072-1083 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 stitch resistances        [see Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 stitch resistances        [see Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 stitch resistances        [see Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding        §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M3 stitch resistances        [see Parent FIGS. 12-13, 31-32, 41, and 43 for corresponding        §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of via resistances, including but not limitedto:

-   -   means/steps for enabling NC detection of AACNT-TS via        resistances [see Parent FIGS. 12-13, 33, 41, 43, and 1629-1673        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of AACNT-AA via        resistances [see Parent FIGS. 12-13, 33, 41, 43, and 1557-1628        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of TS-AA via resistances        [see Parent FIGS. 12-13, 33, 41, 43, and 2315-2330 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-GATE via        resistances [see Parent FIGS. 12-13, 33, 41, 43, 48, and        1699-2005 for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT via        resistances [see Parent FIGS. 12-13, 33, 41, 43, and 1674-1682        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of GATECNT-AACNT-GATE via        resistances [see Parent FIGS. 12-13, 33, 41, 43, and 1683-1698        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATECNT via        resistances [see Parent FIGS. 12-13, 33, 41, 43, and 2375-2439        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AA via resistances        [see Parent FIGS. 12-13, 33, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 via resistances [see        Parent FIGS. 12-13, 33, 41, 43, and 2331-2344 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-TS via resistances        [see Parent FIGS. 12-13, 33, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT via        resistances [see Parent FIGS. 12-13, 33, 41, 43, and 2345-2374        for corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-GATE via resistances        [see Parent FIGS. 12-13, 33, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 via resistances [see        Parent FIGS. 12-13, 33, 41, 43, and 2440-2441 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-V0 resistances [see        Parent FIGS. 12-13, 33, 41, 43, and 2006-2220 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 via resistances        [see Parent FIGS. 12-13, 33, 41, 43, and 2442-2459 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M2 via resistances        [see Parent FIGS. 12-13, 33, 41, 43, and 2221-2256 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-GATECNT via        resistances [see Parent FIGS. 12-13, 33, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3-V2 via resistances        [see Parent FIGS. 12-13, 33, 41, 43, and 2257-2274 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M1-AANCT via        resistances [see Parent FIGS. 12-13, 33, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2-M2 via resistances        [see Parent FIGS. 12-13, 33, 41, and 43 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection V3 via resistances [see        Parent FIGS. 12-13, 33, 41, 43, and 2460-2461 for corresponding        §112(f) structure/acts];    -   means/steps for enabling NC detection of M4-V3 via resistances        [see Parent FIGS. 12-13, 33, 41, 43, and 2275-2296 for        corresponding §112(f) structure/acts]; and,    -   means/steps for enabling NC detection of M5-V4 via resistances        [see Parent FIGS. 12-13, 33, 41, 43, and 2297-2314 for        corresponding §112(f) structure/acts].

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of metal island resistances, including but notlimited to:

-   -   means/steps for enabling NC detection of M1 metal island        resistances [see Parent FIGS. 12-13, 34-35, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M2 metal island        resistances [see Parent FIGS. 12-13, 34-35, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of M3 metal island        resistances [see Parent FIGS. 12-13, 34-35, 41, and 43 for        corresponding §112(f) structure/acts];

Still further aspects of the invention relate to wafers, chips, andprocesses for making them that include/utilize DOEs based on means/stepsfor enabling NC detection of merged-via resistances, including but notlimited to:

-   -   means/steps for enabling NC detection of V0-GATECNT merged via        resistances [see Parent FIGS. 12-13, 36, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0 merged via        resistances [see Parent FIGS. 12-13, 36, 41, 43, and 735-785 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V0-AACNT merged via        resistances [see Parent FIGS. 12-13, 36, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1 merged via        resistances [see Parent FIGS. 12-13, 36, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V2 merged via        resistances [see Parent FIGS. 12-13, 36, 41, and 43 for        corresponding §112(f) structure/acts];    -   means/steps for enabling NC detection of V1-M1 merged via        resistances [see Parent FIGS. 12-13, 36, 41, and 43 for        corresponding §112(f) structure/acts]; and,        means/steps for enabling NC detection of V2-M2 merged via        resistances [see Parent FIGS. 12-13, 36, 41, and 43 for        corresponding §112(f) structure/acts].

Still further aspects of the invention relate to mesh-style NCEM pads,and their use with in-line process control/optimization, such padscomprising, for example: at least two parallel, elongated AACNTfeatures, extending longitudinally in a first direction; at least twoparallel, elongated GATECNT features, extending longitudinally in asecond direction, perpendicular to the first direction; wherein thefeatures are positioned such that each of the AANCT features intersectseach of the GATECNT features. Such pads may include at least three (orfour, or five, or six, etc.) parallel, elongated AACNT features thatextend longitudinally in the first direction, and/or at least three (orfour, or five, or six, etc.) parallel, elongated GATECNT features thatextend longitudinally in the second direction. Such pads may be part ofan assembly that includes: a mesh-style NCEM pad; and, an upper layerNCEM pad, overlying the mesh-style NCEM pad, said upper layer NCEM padcomprising: one or more mask-patterned features, in a first wiring layer(M1), that substantially cover the mesh-style NCEM pad; and, one or moremask-patterned features, in a via to interconnect stack (V0) layer, thatprovide electrical connection(s) between the M1 feature(s) and themesh-style NCEM pad. Such V0 features may be positioned at theintersections of the underlying AACNT and GATECNT features, or may bepositioned to avoid intersections of the underlying AACNT and GATECNTfeatures. The one or more M1 features may include multiple, parallel,elongated M1 features. Any of the aforesaid features may besingle-patterned, double-patterned, triple-patterned, etc. Suchmesh-style NCEM pads may be used in NCEM-enabled fill cells, includingbut not limited to: AA-tip-to-tip-short-configured, NCEM-enabled fillcells; AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells;AACNT-AA-tip-to-tip-short-configured, NCEM-enabled fill cells;AACNT-TS-tip-to-tip-short-configured, NCEM-enabled fill cells;TS-tip-to-tip-short-configured, NCEM-enabled fill cells;GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V0-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-tip-short-configured, NCEM-enabled fill cells;AA-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATE-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;TS-GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-TS-tip-to-side-short-configured, NCEM-enabled fill cells;M1-tip-to-side-short-configured, NCEM-enabled fill cells;V0-tip-to-side-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-side-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-side-short-configured, NCEM-enabled fill cells;V1-tip-to-side-short-configured, NCEM-enabled fill cells;M2-tip-to-side-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-side-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-tip-to-side-short-configured, NCEM-enabled fill cells;V2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-side-short-configured, NCEM-enabled fill cells;AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;TS-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-side-to-side-short-configured, NCEM-enabled fill cells;M1-side-to-side-short-configured, NCEM-enabled fill cells;V0-side-to-side-short-configured, NCEM-enabled fill cells;M1-V0-side-to-side-short-configured, NCEM-enabled fill cells;V1-M1-side-to-side-short-configured, NCEM-enabled fill cells;V1-side-to-side-short-configured, NCEM-enabled fill cells;M2-side-to-side-short-configured, NCEM-enabled fill cells;M2-V1-side-to-side-short-configured, NCEM-enabled fill cells;V2-M2-side-to-side-short-configured, NCEM-enabled fill cells;M3-side-to-side-short-configured, NCEM-enabled fill cells;V2-side-to-side-short-configured, NCEM-enabled fill cells;M3-V2-side-to-side-short-configured, NCEM-enabled fill cells;AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-TS-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATECNT-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AACNT-L-shape-interlayer-short-configured, NCEM-enabledfill cells; V0-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-V2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; AA-diagonal-short-configured, NCEM-enabled fill cells;TS-diagonal-short-configured, NCEM-enabled fill cells;AACNT-diagonal-short-configured, NCEM-enabled fill cells;AACNT-AA-diagonal-short-configured, NCEM-enabled fill cells;GATE-diagonal-short-configured, NCEM-enabled fill cells;GATE-AACNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-GATE-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-diagonal-short-configured, NCEM-enabled fill cells;M1-diagonal-short-configured, NCEM-enabled fill cells;V0-diagonal-short-configured, NCEM-enabled fill cells;M1-V0-diagonal-short-configured, NCEM-enabled fill cells;V1-M1-diagonal-short-configured, NCEM-enabled fill cells;V1-diagonal-short-configured, NCEM-enabled fill cells;M2-diagonal-short-configured, NCEM-enabled fill cells;M2-V1-diagonal-short-configured, NCEM-enabled fill cells;M3-diagonal-short-configured, NCEM-enabled fill cells;V2-M2-diagonal-short-configured, NCEM-enabled fill cells;V2-diagonal-short-configured, NCEM-enabled fill cells;M3-V2-diagonal-short-configured, NCEM-enabled fill cells;AA-corner-short-configured, NCEM-enabled fill cells;AACNT-corner-short-configured, NCEM-enabled fill cells;AACNT-AA-corner-short-configured, NCEM-enabled fill cells;GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-TS-corner-short-configured, NCEM-enabled fill cells;GATECNT-corner-short-configured, NCEM-enabled fill cells;GATECNT-AA-corner-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-corner-short-configured, NCEM-enabled fill cells;M1-corner-short-configured, NCEM-enabled fill cells;V0-corner-short-configured, NCEM-enabled fill cells;M1-V0-corner-short-configured, NCEM-enabled fill cells;V1-M1-corner-short-configured, NCEM-enabled fill cells;V1-corner-short-configured, NCEM-enabled fill cells;M2-corner-short-configured, NCEM-enabled fill cells;M2-V1-corner-short-configured, NCEM-enabled fill cells;M3-corner-short-configured, NCEM-enabled fill cells;V2-M2-corner-short-configured, NCEM-enabled fill cells;V2-corner-short-configured, NCEM-enabled fill cells;M3-V2-corner-short-configured, NCEM-enabled fill cells;GATE-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATE-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-GATECNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V1-V0-interlayer-overlap-short-configured, NCEM-enabled fill cells;M2-M1-interlayer-overlap-short-configured, NCEM-enabled fill cells;V2-V1-interlayer-overlap-short-configured, NCEM-enabled fill cells;M3-M2-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATECNT-via-chamfer-short-configured, NCEM-enabled fill cells;V0-AACNT-via-chamfer-short-configured, NCEM-enabled fill cells;V1-M1-via-chamfer-short-configured, NCEM-enabled fill cells;V2-M2-via-chamfer-short-configured, NCEM-enabled fill cells;V3-M3-via-chamfer-short-configured, NCEM-enabled fill cells;V0-merged-via-short-configured, NCEM-enabled fill cells;V1-merged-via-short-configured, NCEM-enabled fill cells;V2-merged-via-short-configured, NCEM-enabled fill cells;AA-snake-open-configured, NCEM-enabled fill cells;TS-snake-open-configured, NCEM-enabled fill cells;AACNT-snake-open-configured, NCEM-enabled fill cells;GATE-snake-open-configured, NCEM-enabled fill cells;GATECNT-snake-open-configured, NCEM-enabled fill cells;V0-snake-open-configured, NCEM-enabled fill cells;M1-snake-open-configured, NCEM-enabled fill cells;M1-V0-AACNT-snake-open-configured, NCEM-enabled fill cells;V1-snake-open-configured, NCEM-enabled fill cells;M2-snake-open-configured, NCEM-enabled fill cells;V2-snake-open-configured, NCEM-enabled fill cells;M3-snake-open-configured, NCEM-enabled fill cells;

AA-stitch-open-configured, NCEM-enabled fill cells;TS-stitch-open-configured, NCEM-enabled fill cells;AACNT-stitch-open-configured, NCEM-enabled fill cells;GATECNT-stitch-open-configured, NCEM-enabled fill cells;V0-stitch-open-configured, NCEM-enabled fill cells;M1-stitch-open-configured, NCEM-enabled fill cells;V1-stitch-open-configured, NCEM-enabled fill cells;M2-stitch-open-configured, NCEM-enabled fill cells;V2-stitch-open-configured, NCEM-enabled fill cells;M3-stitch-open-configured, NCEM-enabled fill cells;AACNT-TS-via-open-configured, NCEM-enabled fill cells;AACNT-AA-via-open-configured, NCEM-enabled fill cells;TS-AA-via-open-configured, NCEM-enabled fill cells;GATECNT-GATE-via-open-configured, NCEM-enabled fill cells;GATECNT-AACNT-via-open-configured, NCEM-enabled fill cells;GATECNT-AACNT-GATE-via-open-configured, NCEM-enabled fill cells;V0-GATECNT-via-open-configured, NCEM-enabled fill cells;V0-AA-via-open-configured, NCEM-enabled fill cells;V0-TS-via-open-configured, NCEM-enabled fill cells;V0-AACNT-via-open-configured, NCEM-enabled fill cells;V0-GATE-via-open-configured, NCEM-enabled fill cells;V0-via-open-configured, NCEM-enabled fill cells;M1-V0-via-open-configured, NCEM-enabled fill cells;V1-via-open-configured, NCEM-enabled fill cells;V1-M1-via-open-configured, NCEM-enabled fill cells;V1-M2-via-open-configured, NCEM-enabled fill cells;M1-GATECNT-via-open-configured, NCEM-enabled fill cells;M1-AANCT-via-open-configured, NCEM-enabled fill cells;V2-M2-via-open-configured, NCEM-enabled fill cells;M3-V2-via-open-configured, NCEM-enabled fill cells;V3-via-open-configured, NCEM-enabled fill cells;M4-V3-via-open-configured, NCEM-enabled fill cells;M5-V4-via-open-configured, NCEM-enabled fill cells;M1-metal-island-open-configured, NCEM-enabled fill cells;M2-metal-island-open-configured, NCEM-enabled fill cells;M3-metal-island-open-configured, NCEM-enabled fill cells;V0-merged-via-open-configured, NCEM-enabled fill cells;V0-AACNT-merged-via-open-configured, NCEM-enabled fill cells;V0-GATECNT-merged-via-open-configured, NCEM-enabled fill cells;V1-merged-via-open-configured, NCEM-enabled fill cells;V2-merged-via-open-configured, NCEM-enabled fill cells;V1-M1-merged-via-open-configured, NCEM-enabled fill cells; and/orV2-M2-merged-via-open-configured, NCEM-enabled fill cells. Using suchmesh-style pads, a method for processing a semiconductor substrate mayinclude: using a first mask to pattern a plurality of adjacent AACNTstripes on the substrate; using a second mask to pattern a plurality ofadjacent GATECNT stripes on the substrate, where the GATECNT stripesperpendicularly overlap the AACNT stripes to form a mesh-style NCEM pad;and, obtaining in-line NCEM from the mesh-style NCEM pad. Such processmay further include: using a third mask to pattern a plurality of V0vias above at least some of the GATECNT and/or AACNT stripes of themesh-style NCEM pad; and, using a fourth mask to pattern one or more M1features above one or more of said V0 vias to form an M1 NCEM pad, andmay further include: obtaining in-line NCEM from the M1 NCEM pad.

Again, generally speaking, and without intending to be limiting, anotheraspect of the invention relates to methods for making integratedcircuits (ICs), comprising, for example, at least: (a) performinginitial processing steps to produce a test wafer that includes a firstDesign of Experiments (DOE) of Non-Contact Electrical Measurement(NCEM)-enabled, via to interconnect stack (V0)-via-open-configured fillcells, said initial processing steps including: (i) patterning, on thetest wafer, a first means for enabling non-contact (NC) detection of V0via opens; and (ii) patterning, on the test wafer, a second means forenabling NC detection of V0 via opens; wherein the first and secondmeans for enabling NC detection of V0 via opens are different; (b)determining a presence or absence of V0 via opens on the test wafer by:performing a voltage contrast examination of NCEM-enabled fill cells inthe first DOE, including at least the first and second means forenabling NC detection of V0 via opens; and (c) using the results fromstep (b) to select NCEM-enabled fill cells for inclusion on a subsequentproduct wafer. In some embodiments, step (c) includes: selecting, forinclusion on the product wafer, a plurality of NCEM-enabled,V0-via-open-configured fill cells, if step (b) indicated a presence ofany V0 via opens. In some embodiments, step (c) includes: omitting, frominclusion on the product wafer, any NCEM-enabled, V0-via-open-configuredfill cells, if step (b) indicated an absence of any V0 via opens. Insome embodiments, the first and second means for enabling NC detectionof V0 via opens are both selected from the list consisting of: aI_PDF_VCI_FILL08_19S2000194 means for enabling NC detection of V0 viaopens; a I_PDF_VCI_FILL12_19S2000294 means for enabling NC detection ofV0 via opens; and a I_PDF_VCI_FILL16_19S2000394 means for enabling NCdetection of V0 via opens. In some embodiments, the first and secondmeans for enabling NC detection of V0 via opens are both selected fromthe list consisting of: a I_PDF_VCI_FILL08_19S2000494 means for enablingNC detection of V0 via opens; a I_PDF_VCI_FILL12_19S2000594 means forenabling NC detection of V0 via opens; and a I_PDF_VCI_FILL16_19S2000694means for enabling NC detection of V0 via opens. In some embodiments,the first and second means for enabling NC detection of V0 via opens areboth selected from the list consisting of: a I_PDF_VCI_FILL08_19S2000794means for enabling NC detection of V0 via opens; aI_PDF_VCI_FILL12_19S2000894 means for enabling NC detection of V0 viaopens; and a I_PDF_VCI_FILL16_19S2000994 means for enabling NC detectionof V0 via opens. In some embodiments, the first and second means forenabling NC detection of V0 via opens are both selected from the listconsisting of: a I_PDF_VCI_FILL08_19S2000A94 means for enabling NCdetection of V0 via opens; a I_PDF_VCI_FILL12_19S2000B94 means forenabling NC detection of V0 via opens; and a I_PDF_VCI_FILL16_19S2000C94means for enabling NC detection of V0 via opens. In some embodiments,the first and second means for enabling NC detection of V0 via opens areboth selected from the list consisting of: a K_V549_PDF_VCI_3000153_01means for enabling NC detection of V0 via opens; anda_V54C_M_PDF_VCI_3000153_01 means for enabling NC detection of V0 viaopens.

Again, generally speaking, and without intending to be limiting, anotheraspect of the invention relates to methods for making ICs, comprising,for example, at least: (a) performing initial processing steps toproduce a test wafer that includes a first DOE of NCEM-enabled,V0-via-open-configured fill cells, said initial processing stepsincluding: (i) patterning, on the test wafer, a first means for enablingNC detection of V0 via opens; and (ii) patterning, on the test wafer, asecond means for enabling NC detection of V0 via opens; wherein thefirst and second means for enabling NC detection of V0 via opens aredifferent; (b) determining a presence or absence of V0 via opens on thetest wafer by: performing a voltage contrast examination of NCEM-enabledfill cells in the first DOE, including at least the first and secondmeans for enabling NC detection of V0 via opens; and (c) using theresults from step (b) in processing of a subsequent product wafer.

Again, generally speaking, and without intending to be limiting, anotheraspect of the invention relates to methods for making ICs, comprising,for example, at least: (a) performing initial processing steps toproduce a test wafer that includes a first DOE of NCEM-enabled,V0-via-open-configured fill cells, said initial processing stepsincluding: (i) first step for enabling, on the test wafer, NC detectionof V0 via opens; and (ii) second step for enabling, on the test wafer,NC detection of V0 via opens; wherein the first and second steps forenabling NC detection of V0 via opens are different; (b) determining apresence or absence of V0 via opens on the test wafer by: performing avoltage contrast examination of NCEM-enabled fill cells in the firstDOE; and (c) using the results from step (b) to select NCEM-enabled fillcells for inclusion on a subsequent product wafer. In some embodiments,step (c) includes: selecting, for inclusion on the product wafer, aplurality of NCEM-enabled, V0-via-open-configured fill cells, if step(b) indicated a presence of any V0 via opens. In some embodiments, step(c) includes: omitting, from inclusion on the product wafer, anyNCEM-enabled, V0-via-open-configured fill cells, if step (b) indicatedan absence of any V0 via opens. In some embodiments, the first andsecond steps for enabling NC detection of V0 via opens are both selectedfrom the list consisting of: a I_PDF_VCI_FILL08_19S2000194 step forenabling NC detection of V0 via opens; a I_PDF_VCI_FILL12_19S2000294step for enabling NC detection of V0 via opens; and aI_PDF_VCI_FILL16_19S2000394 step for enabling NC detection of V0 viaopens. In some embodiments, the first and second steps for enabling NCdetection of V0 via opens are both selected from the list consisting of:a I_PDF_VCI_FILL08_19S2000494 step for enabling NC detection of V0 viaopens; a I_PDF_VCI_FILL12_19S2000594 step for enabling NC detection ofV0 via opens; and a I_PDF_VCI_FILL16_19S2000694 step for enabling NCdetection of V0 via opens. In some embodiments, the first and secondsteps for enabling NC detection of V0 via opens are both selected fromthe list consisting of: a I_PDF_VCI_FILL08_19S2000794 step for enablingNC detection of V0 via opens; a I_PDF_VCI_FILL12_19S2000894 step forenabling NC detection of V0 via opens; and a I_PDF_VCI_FILL16_19S2000994step for enabling NC detection of V0 via opens. In some embodiments, thefirst and second steps for enabling NC detection of V0 via opens areboth selected from the list consisting of: a I_PDF_VCI_FILL08_19S2000A94step for enabling NC detection of V0 via opens; aI_PDF_VCI_FILL12_19S2000B94 step for enabling NC detection of V0 viaopens; and a I_PDF_VCI_FILL16_19S2000C94 step for enabling NC detectionof V0 via opens. In some embodiments, the first and second steps forenabling NC detection of V0 via opens are both selected from the listconsisting of: a K_V549_PDF_VCI_3000153_01 step for enabling NCdetection of V0 via opens; and a K_V54C_M_PDF_VCI_3000153_01 step forenabling NC detection of V0 via opens. And in some embodiments, step (a)further includes patterning at least three additional fill cellsselected from the list consisting of: AA-tip-to-tip-short-configured,NCEM-enabled fill cells; AACNT-tip-to-tip-short-configured, NCEM-enabledfill cells; AACNT-AA-tip-to-tip-short-configured, NCEM-enabled fillcells; TS-tip-to-tip-short-configured, NCEM-enabled fill cells;GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V0-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-tip-short-configured, NCEM-enabled fill cells;AA-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATE-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;TS-GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;M1-tip-to-side-short-configured, NCEM-enabled fill cells;V0-tip-to-side-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-side-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-side-short-configured, NCEM-enabled fill cells;V1-tip-to-side-short-configured, NCEM-enabled fill cells;M2-tip-to-side-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-side-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-tip-to-side-short-configured, NCEM-enabled fill cells;V2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-side-short-configured, NCEM-enabled fill cells;AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;TS-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-side-to-side-short-configured, NCEM-enabled fill cells;M1-side-to-side-short-configured, NCEM-enabled fill cells;V0-side-to-side-short-configured, NCEM-enabled fill cells;M1-V0-side-to-side-short-configured, NCEM-enabled fill cells;V1-M1-side-to-side-short-configured, NCEM-enabled fill cells;V1-side-to-side-short-configured, NCEM-enabled fill cells;M2-side-to-side-short-configured, NCEM-enabled fill cells;M2-V1-side-to-side-short-configured, NCEM-enabled fill cells;V2-M2-side-to-side-short-configured, NCEM-enabled fill cells;M3-side-to-side-short-configured, NCEM-enabled fill cells;V2-side-to-side-short-configured, NCEM-enabled fill cells;M3-V2-side-to-side-short-configured, NCEM-enabled fill cells;AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-TS-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATECNT-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AACNT-L-shape-interlayer-short-configured, NCEM-enabledfill cells; V0-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-V2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; AA-diagonal-short-configured, NCEM-enabled fill cells;TS-diagonal-short-configured, NCEM-enabled fill cells;AACNT-diagonal-short-configured, NCEM-enabled fill cells;AACNT-AA-diagonal-short-configured, NCEM-enabled fill cells;GATE-diagonal-short-configured, NCEM-enabled fill cells;GATE-AACNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-GATE-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-diagonal-short-configured, NCEM-enabled fill cells;M1-diagonal-short-configured, NCEM-enabled fill cells;V0-diagonal-short-configured, NCEM-enabled fill cells;M1-V0-diagonal-short-configured, NCEM-enabled fill cells;V1-M1-diagonal-short-configured, NCEM-enabled fill cells;V1-diagonal-short-configured, NCEM-enabled fill cells;M2-diagonal-short-configured, NCEM-enabled fill cells;M2-V1-diagonal-short-configured, NCEM-enabled fill cells;M3-diagonal-short-configured, NCEM-enabled fill cells;V2-M2-diagonal-short-configured, NCEM-enabled fill cells;V2-diagonal-short-configured, NCEM-enabled fill cells;M3-V2-diagonal-short-configured, NCEM-enabled fill cells;AA-corner-short-configured, NCEM-enabled fill cells;AACNT-corner-short-configured, NCEM-enabled fill cells;AACNT-AA-corner-short-configured, NCEM-enabled fill cells;GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-TS-corner-short-configured, NCEM-enabled fill cells;GATECNT-corner-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-corner-short-configured, NCEM-enabled fill cells;M1-corner-short-configured, NCEM-enabled fill cells;V0-corner-short-configured, NCEM-enabled fill cells;M1-V0-corner-short-configured, NCEM-enabled fill cells;V1-M1-corner-short-configured, NCEM-enabled fill cells;V1-corner-short-configured, NCEM-enabled fill cells;M2-corner-short-configured, NCEM-enabled fill cells;M2-V1-corner-short-configured, NCEM-enabled fill cells;M3-corner-short-configured, NCEM-enabled fill cells;V2-M2-corner-short-configured, NCEM-enabled fill cells;V2-corner-short-configured, NCEM-enabled fill cells;M3-V2-corner-short-configured, NCEM-enabled fill cells;GATE-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATE-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-GATECNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V1-V0-interlayer-overlap-short-configured, NCEM-enabled fill cells;M2-M1-interlayer-overlap-short-configured, NCEM-enabled fill cells;V2-V1-interlayer-overlap-short-configured, NCEM-enabled fill cells;M3-M2-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATECNT-via-chamfer-short-configured, NCEM-enabled fill cells;V0-AACNT-via-chamfer-short-configured, NCEM-enabled fill cells;V1-M1-via-chamfer-short-configured, NCEM-enabled fill cells;V2-M2-via-chamfer-short-configured, NCEM-enabled fill cells;V0-merged-via-short-configured, NCEM-enabled fill cells;V1-merged-via-short-configured, NCEM-enabled fill cells;V2-merged-via-short-configured, NCEM-enabled fill cells;AA-snake-open-configured, NCEM-enabled fill cells;TS-snake-open-configured, NCEM-enabled fill cells;AACNT-snake-open-configured, NCEM-enabled fill cells;GATE-snake-open-configured, NCEM-enabled fill cells;GATECNT-snake-open-configured, NCEM-enabled fill cells;V0-snake-open-configured, NCEM-enabled fill cells;M1-snake-open-configured, NCEM-enabled fill cells;V1-snake-open-configured, NCEM-enabled fill cells;M2-snake-open-configured, NCEM-enabled fill cells;V2-snake-open-configured, NCEM-enabled fill cells;M3-snake-open-configured, NCEM-enabled fill cells;AA-stitch-open-configured, NCEM-enabled fill cells;TS-stitch-open-configured, NCEM-enabled fill cells;AACNT-stitch-open-configured, NCEM-enabled fill cells;GATECNT-stitch-open-configured, NCEM-enabled fill cells;V0-stitch-open-configured, NCEM-enabled fill cells;M1-stitch-open-configured, NCEM-enabled fill cells;V1-stitch-open-configured, NCEM-enabled fill cells;M2-stitch-open-configured, NCEM-enabled fill cells;V2-stitch-open-configured, NCEM-enabled fill cells;M3-stitch-open-configured, NCEM-enabled fill cells;AACNT-TS-via-open-configured, NCEM-enabled fill cells;AACNT-AA-via-open-configured, NCEM-enabled fill cells;TS-AA-via-open-configured, NCEM-enabled fill cells;GATECNT-AACNT-via-open-configured, NCEM-enabled fill cells;GATECNT-AACNT-GATE-via-open-configured, NCEM-enabled fill cells;GATECNT-GATE-via-open, NCEM-enabled fill cells;V0-GATECNT-via-open-configured, NCEM-enabled fill cells;V0-AA-via-open-configured, NCEM-enabled fill cells;V0-TS-via-open-configured, NCEM-enabled fill cells;V0-AACNT-via-open-configured, NCEM-enabled fill cells;V0-GATE-via-open-configured, NCEM-enabled fill cells;M1-V0-via-open-configured, NCEM-enabled fill cells;V1-M1-via-open-configured, NCEM-enabled fill cells;V1-M2-via-open-configured, NCEM-enabled fill cells;M1-GATECNT-via-open-configured, NCEM-enabled fill cells;M1-AANCT-via-open-configured, NCEM-enabled fill cells;V2-M2-via-open-configured, NCEM-enabled fill cells;M3-V2-via-open-configured, NCEM-enabled fill cells;M1-metal-island-open-configured, NCEM-enabled fill cells;M2-metal-island-open-configured, NCEM-enabled fill cells;M3-metal-island-open-configured, NCEM-enabled fill cells;V0-merged-via-open-configured, NCEM-enabled fill cells;V0-AACNT-merged-via-open-configured, NCEM-enabled fill cells;V0-GATECNT-merged-via-open-configured, NCEM-enabled fill cells;V1-merged-via-open-configured, NCEM-enabled fill cells;V2-merged-via-open-configured, NCEM-enabled fill cells;V1-M1-merged-via-open-configured, NCEM-enabled fill cells; andV2-M2-merged-via-open-configured, NCEM-enabled fill cells.

BRIEF DESCRIPTION OF THE FIGURES

To provide a more complete understanding of the present disclosure andfeatures and advantages thereof, reference is made to the following setof figures, taken in conjunction with the accompanying description, inwhich:

[Note regarding the figures in this application, as well as in the '463provisional application and the incorporated '256, '267, and '274 parentapplications: Those figures numbered 52[A,B,C], 53[A,B,C], et seq. areto-scale layouts of the exemplified cells. While certain detail in theselayouts may be difficult to see on the application or patent aspublished, persons skilled in the art will appreciate that the SCORE tabin USPTO's Public PAIR system provides access to the applicant's PDFdrawings, as originally uploaded, which can be electronically downloadedand blown up to reveal any level of desired detail. Additionally,references herein to “FIG.” should be read as referring to the figure(s)in this application, whereas references to “Parent FIG.” should be readas referring to the correspondingly numbered figure(s) in the parentapplications.]

FIG. 1 depicts an outline of illustrative fill cells, suitable for usein connection certain embodiments of the invention;

FIG. 2 depicts an exemplary standard cell logic section with (shaded)NCEM-enabled fill cells, of various widths;

FIG. 3 depicts an exemplary standard cell logic section with a row (orportion thereof) that contains NCEM-enabled fill cells, of variouswidths;

FIG. 4 depicts an exemplary standard cell logic section with a testblock area (lower right portion) populated with NCEM-enabled fill cells,of various widths;

FIG. 5 depicts an exemplary portion of a test chip/wafer comprised ofNCEM-enabled fill cells, of various widths;

FIG. 6 conceptually depicts a portion of an exemplary chip/wafer inwhich a region comprised only (or almost only) of NCEM-enabled fillcells is positioned between two or more standard cell regions;

FIG. 7 depicts a cross-sectional, topological view of a monolithic ICstructure;

FIG. 8 depicts a physical layer stack for an exemplary CMOS process;

FIGS. 9A-9F depict several illustrative designs for a NCEM-enabled pad,suitable for use in connection with certain embodiments of theinvention;

FIG. 9G depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes;

FIG. 9H depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes;

FIG. 9I depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes;

FIG. 9J depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes;

FIG. 9K depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes;

FIG. 9L depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes;

FIG. 9M depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes;

FIG. 9N depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes;

FIG. 9O depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes;

FIG. 9P depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9Q depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9R depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9S depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9T depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9U depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9V depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9W depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9X depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9Y depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9Z depicts an exemplary mesh-style, NCEM-enabled pad, formed from a10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9AA depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9BB depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9CC depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9DD depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9EE depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9FF depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points, with an overlying,solid M1 pad, and a plurality of V0 vias positioned to avoidGATECNT-AACNT junction points;

FIG. 9GG depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9HH depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9II depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9JJ depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9KK depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9LL depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9MM depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9NN depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9OO depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9PP depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned at GATECNT-AACNT junction points;

FIG. 9QQ depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9RR depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9SS depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9TT depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9UU depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9VV depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9WW depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9XX depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9YY depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid M1 pad, and a plurality of V0 viaspositioned to avoid GATECNT-AACNT junction points;

FIG. 9ZZ depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9AAA depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9BBB depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9CCC depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9DDD depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9EEE depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9FFF depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9GGG depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9HHH depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9III depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9JJJ depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9KKK depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9LLL depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9MMM depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9NNN depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9OOO depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9PPP depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9QQQ depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, double-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9RRR depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9SSS depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9TTT depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9UUU depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9VVV depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9WWW depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9XXX depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9YYY depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9ZZZ depicts an exemplary mesh-style, NCEM-enabled pad, formed froma 10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned at GATECNT-AACNT junction points;

FIG. 9AAAA depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of single-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9BBBB depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of double-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9CCCC depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of single-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9DDDD depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of double-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9EEEE depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of triple-patterned GATECNT and single-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9FFFF depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of triple-patterned GATECNT and double-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9GGGG depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of single-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9HHHH depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of double-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIG. 9IIII depicts an exemplary mesh-style, NCEM-enabled pad, formedfrom a 10×9 grid of triple-patterned GATECNT and triple-patterned AACNTstripes, with an overlying, non-solid, triple-patterned M1 pad, and aplurality of V0 vias positioned to avoid GATECNT-AACNT junction points;

FIGS. 10-11, in conjunction with the description below, depict theoverall physical structure and connectivity of short-configured (and/orleakage-configured), NCEM-enabled fill cells in accordance with certainaspects of the invention;

FIGS. 12-13, in conjunction with the description below, depict theoverall physical structure and connectivity of open-configured (and/orresistance-configured), NCEM-enabled fill cells in accordance withcertain aspects of the invention;

FIG. 14 depicts a plan view of exemplary test area geometry for anexemplary tip-to-tip-short-configured, NCEM-enabled fill cell;

FIG. 15 depicts another plan view of exemplary test area geometry for anexemplary tip-to-tip-short-configured, NCEM-enabled fill cell;

FIG. 16 depicts a plan view of exemplary test area geometry for anexemplary tip-to-side-short-configured, NCEM-enabled fill cell;

FIG. 17 depicts a plan view of exemplary test area geometry for anexemplary side-to-side-short-configured, NCEM-enabled fill cell;

FIG. 18 depicts a plan view of exemplary test area geometry for anexemplary L-shape-interlayer-short-configured, NCEM-enabled fill cell;

FIG. 19 depicts a plan view of exemplary test area geometry for anotherexemplary L-shape-interlayer-short-configured, NCEM-enabled fill cell;

FIG. 20 depicts a plan view of exemplary test area geometry for anotherexemplary L-shape-interlayer-short-configured, NCEM-enabled fill cell;

FIG. 21 depicts a plan view of exemplary test area geometry for anotherexemplary L-shape-interlayer-short-configured, NCEM-enabled fill cell;

FIG. 22 depicts a plan view of exemplary test area geometry for anotherexemplary L-shape-interlayer-short-configured, NCEM-enabled fill cell;

FIG. 23 depicts a plan view of exemplary test area geometry for anexemplary diagonal-short-configured, NCEM-enabled fill cell;

FIG. 24 depicts a plan view of exemplary test area geometry for anexemplary corner-short-configured, NCEM-enabled fill cell;

FIG. 25 depicts a plan view of exemplary test area geometry for anotherexemplary corner-short-configured, NCEM-enabled fill cell;

FIG. 26 depicts a plan view of exemplary test area geometry for anotherexemplary corner-short-configured, NCEM-enabled fill cell;

FIG. 27 depicts a plan view of exemplary test area geometry for anexemplary interlayer-overlap-short-configured, NCEM-enabled fill cell;

FIG. 28 depicts a plan view of exemplary test area geometry for anexemplary via-chamfer-short-configured, NCEM-enabled fill cell;

FIG. 29 depicts a plan view of exemplary test area geometry for anexemplary merged-via-short-configured, NCEM-enabled fill cell;

FIG. 30 depicts a plan view of exemplary test area geometry for anexemplary snake-open-configured, NCEM-enabled fill cell;

FIG. 31 depicts a plan view of exemplary test area geometry for anexemplary stitch-open-configured, NCEM-enabled fill cell;

FIG. 32 depicts a plan view of exemplary test area geometry for anotherexemplary stitch-open-configured, NCEM-enabled fill cell;

FIG. 33 depicts a plan view of exemplary test area geometry for anexemplary via-open-configured, NCEM-enabled fill cell;

FIG. 34 depicts a plan view of exemplary test area geometry for anexemplary metal-island-open-configured, NCEM-enabled fill cell;

FIG. 35 depicts a cross-sectional view of exemplary test area geometryfor the exemplary metal-island-open-configured, NCEM-enabled fill cell;

FIG. 36 depicts a plan view of exemplary test area geometry for anexemplary merged-via-open-configured, NCEM-enabled fill cell;

FIG. 37 shows exemplary expanded test area geometry from a 1^(st)variant of a NCEM-enabled fill cell;

FIG. 38 shows exemplary expanded test area geometry from a 2^(nd)variant of a NCEM-enabled fill cell;

FIG. 39 shows the logical AND of patterning within both expanded testareas (of FIGS. 37 & 38);

FIG. 40 shows the logical OR of patterning within both expanded testareas (of FIGS. 37 & 38);

FIG. 41 depicts an exemplary process flow, suitable for use inconnection with certain embodiments of the invention;

FIG. 42 depicts an exemplary process flow for obtaining and (optionally)using measurements from mesh-style NCEM pads;

FIG. 43 depicts another exemplary process flow, suitable for use inaccordance with certain embodiments of the invention;

FIG. 44 depicts a plan view of an exemplary M1-snake-open-configured,NCEM-enabled fill cell;

FIG. 45 depicts a plan view of an exemplaryAACNT-tip-to-side-short-configured, NCEM-enabled fill cell;

FIGS. 46A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0 and M1 layers—of anexemplary TS-GATE-side-to-side-short-configured, NCEM-enabled fill cellof type PDF_D_VCI_V16_14S1_01;

FIGS. 47A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0 and M1 layers—of anexemplary GATECNT-AACNT-side-to-side-short-configured, NCEM-enabled fillcell of type PDF_D_VCI_V16_14S1_05;

FIGS. 48A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0 and M1 layers—of anexemplary GATECNT-via-open-configured, NCEM-enabled fill cell of typePDF_D_VCI_V16_14S1_08;

FIGS. 49A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0 and M1 layers—of anexemplary GATE-AA-tip-to-side-short-configured, NCEM-enabled fill cellof type PDF_D_VCI_V16_14S1_11;

FIGS. 50A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0 and M1 layers—of anexemplary GATE-AA-tip-to-side-short-configured, NCEM-enabled fill cellof type PDF_D_VCI_V16_14S1_12;

FIG. 51 contains a layer legend for FIGS. 52A-C, 53A-C, 54A-C, etc.,which follow;

FIGS. 52A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL08_19S2000194;

FIGS. 53A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL12_19S2000294;

FIGS. 54A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL16_19S2000394;

FIGS. 55A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL08_19S2000494;

FIGS. 56A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL12_19S2000594;

FIGS. 57A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL16_19S2000694;

FIGS. 58A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL08_19S2000794;

FIGS. 59A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL12_19S2000B94;

FIGS. 60A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL16_19S2000994;

FIGS. 61A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL08_19S2000A94;

FIGS. 62A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL12_19S2000B94;

FIGS. 63A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeI_PDF_VCI_FILL16_19S2000C94;

FIGS. 64A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeK_V549_PDF_VCI_3000153_01; and,

FIGS. 65A-C respectively depict plan views of—(A) all layers; (B) NWELL,AA, GATE, GATECNT, TS, and AACNT layers; (C) V0, and M1 layers—of anexemplary V0-via-open-configured, NCEM-enabled fill cell of typeL_V54C_M_PDF_VCI_3000153_01.

DESCRIPTION OF EXEMPLARY/PREFERRED EMBODIMENT(S)

Reference is now made to FIG. 1, which depicts an outline ofillustrative fill cells suitable for use in connection certainembodiments of the invention, such fill cells are typically provided ina uniform height and various widths, traditionally multiples of theminimum contacted poly pitch (CPP) permitted by the fabrication process.FIG. 1 includes fill cells of width 4 CPP, 8 CPP, 16 CPP, 32 CPP, and 64CPP, but any collection of widths—or just a single width—is possible.Furthermore, certain embodiments of the invention may include double ortriple height fill cells, as well. As persons skilled in the art willappreciate, traditional fill cells include certain features necessaryfor compatibility with the logic cells used to form circuits on thechip. Such necessary features include a height that is consistent withlogic cells in the library (or an integer multiple of that height), aswell as power/ground rails that extend horizontally across the fillcells (traditionally, though not necessarily, at the top and bottom ofeach cell). Such necessary features are preferably maintained in theNCEM-enabled fill cells used in connection with the present invention.

Reference is now made to FIG. 2, which depicts an exemplary standardcell logic section with (shaded) NCEM-enabled fill cells, of variouswidths. As depicted, the NCEM-enabled fill cells are preferablyinstantiated wherever a traditional fill cell would otherwise be placed.However, the invention places no restriction on the distribution of suchNCEM-enabled fill cells. While they would typically appear in eachstandard cell row, they need not. The fill cell placement can beregular, semi-regular (e.g., at least one fill cell every X nm, or everyY cells), or irregular. Two fill cells can be adjacent to each other.There may be some double height (or greater) fill cells. And the logicsection may include both NCEM-enabled as well as other types of fillcells.

Reference is now made to FIG. 3, which depicts an exemplary standardcell logic section with a row (or portion thereof) that containsNCEM-enabled fill cells, of various widths. As depicted, certainembodiments of the invention may include complete row(s), or contiguousportion(s) thereof, populated entirely with NCEM-enabled fill cells.Such row(s) may include fill cells of varying or fixed widths, and suchrow(s) may be adjacent or separated, and may be distributed regularly,semi-regularly or irregularly throughout the logic section.

Reference is now made to FIG. 4, which depicts an exemplary standardcell logic section with a test block area (lower right portion)populated with NCEM-enabled fill cells, of various widths. Such testblock section(s) need not be entirely contiguous, need not be generallyrectangular or square, may include fill cells of a single width ormultiple widths, and one or multiple heights.

Reference is now made to FIG. 5, which depicts an exemplary portion of atest chip/wafer comprised of NCEM-enabled fill cells, of various widths.Such test vehicles may comprise a die, a chip, a wafer, or a portion ofany of these. Such test vehicles need not be entirely contiguous, mayhave any overall shape, and may include fill cells of a single width ormultiple widths, and one or multiple heights.

Reference is now made to FIG. 6, which conceptually depicts a portion ofan exemplary chip/die/wafer with a region comprised only (or almostonly) of NCEM-enabled fill cells positioned between two or more standardcell regions (such as those of FIGS. 2-5). As persons skilled in the artwill appreciate, FIG. 6 illustrates how various embodiments of theinvention may instantiate/distribute the inventive NCEM-enabled fillcells (and DOEs based on them) in any manner whatsoever, and that thedistribution patterns—both regular and irregular—may vary throughoutdifferent regions of a chip or wafer.

As persons skilled in the art will appreciate, the configurations ofFIGS. 2-5 and 6 are mere examples of many available possibilities, andare not intended to be limiting or exhaustive. Furthermore, such skilledpersons will appreciate that any given die, chip or wafer may include acombination of these and/or other possible configurations.

Reference is now made to FIG. 7, which depicts cross-sectional,topological view of a monolithic IC structure to which the invention maybe applied. This topological view depicts—from bottom to top—threevertically defined portions: (i) substrate; (ii) connector stack; and(iii) interconnect stack.

The substrate preferably comprises a wafer, die, or other portion ofmonocrystalline silicon, or another substrate suitable for formingsemiconductor devices, such as silicon-on-insulator (SOI), Ge, C, GaAs,InP, GaInAs, AlAs, GaSb, (Ga,Mn)As, GaP, GaN, InAS, SiGe, SiSn, CdSe,CdTe, CdHgTe, ZnS, SiC, etc. Generally speaking, the substraterepresents the object to which manufacturing steps (e.g., deposition,masking, etching, implantation) are initially applied, and is the objectwithin which, or upon which, switching devices (e.g., FETs, bipolartransistors, photodiodes, magnetic devices, etc.) or storage devices(e.g., charged oxides, capacitors, phase change memories, etc.) arebuilt.

The connector stack is a collection of multiple layers, generally formedon top of the substrate, that supports localized connections betweendevices in, or on, the substrate, and/or connections to wires in aninterconnect stack located above. The layers that make up the connectorstack need not be strictly “stacked”; some can be partially or fullyco-planar. For example, as illustrated in FIG. 8, which depicts aphysical view of an exemplary CMOS layer stack, the source/drain contactand gate contact layers are partially co-planar because they sharevertical extent, but on the bottom, the source/drain contact layerextends below the bottom of the gate contact layer, and on the top, thegate contact layer extends above the top of the source/drain contactlayer. An example of full co-planarity would be where these two layershad identical vertical extent.

The connector stack supports various types of “connectors” and“jumpers,” as illustrated in FIG. 7. These illustrative connectors andjumpers are not intended to represent individual physical layers, butrather conductive pathways that connect the identified elements. Aspersons skilled in the art will appreciate, each connector or jumper canbe implemented using one or more manufactured “layers,” where somelayers may appear as parts of multiple types of connectors/jumpers.

FIG. 7. specifically illustrates the following connectors/jumpers:

-   -   Control element connector        -   A conductive pathway between (i) one or more control            elements and (ii) a wire in the first (e.g., m1) layer of            the interconnect stack. Control element connectors will also            contact any interconnect jumpers, substrate connectors, or            control element jumpers that they cross.    -   Substrate connector        -   A conductive pathway between (i) a portion of the substrate            and (ii) a wire in the first layer of the interconnect            stack. Substrate connectors will also contact any            interconnect jumpers, substrate jumpers, control element            connectors, or control element jumpers that they cross.    -   Substrate jumper        -   A conductive pathway between two portions of the substrate            that would not be connected without the substrate jumper.            Substrate jumpers will also contact any substrate            connectors—but not interconnect jumpers—that they cross.    -   Interconnect jumper        -   A conductive pathway between two wires in the first            interconnect layer that would not be connected without the            interconnect jumper. Interconnect jumpers will also contact            any substrate connectors or control element connectors that            they cross.    -   Control element jumper        -   A conductive pathway between two control elements. Control            element jumpers will also contact any control elements,            control element connectors, or substrate connectors that            they cross.    -   Non-adjacent control element jumper, not depicted in FIG. 7, but        defined as follows:        -   A conductive pathway between two control elements.            Non-adjacent control element jumpers can pass over other            control elements without contacting them. Non-adjacent            control element jumpers will contact any control element            connectors or substrate connectors that they cross.

Above the connector stack lies the interconnect stack. The interconnectstack is comprised of conductive wiring layers (labeled “m1,” “m2,”etc.—that need only be conductive, not necessarily metallic) withconductive vias (labeled “v1,” “v2,” etc.) that connect adjacent wiringlayers. While three wiring layers are shown in FIGS. 7-8, it isunderstood that this number could vary from one to ten or more.Furthermore, while the vias and wiring layers in FIGS. 7-8 are shown asnon-overlapping, it is possible for vias to extend into one or both ofthe wiring layers that they connect, or traverse more than two wiringlayers.

Reference is now made to FIG. 8, which depicts a (simplified) layerstack for an exemplary CMOS process, with the correspondence betweenmajor regions—substrate, connector stack, interconnect stack—and processlayers indicated on the drawing. As depicted in FIG. 8, the substratehosts the source(s)/drain(s) of the FETs, the device isolation trenches(STI), and a lower portion of the gate(s). The connector stackimplements the upper portions of the gate(s), the source/drainsilicide(s), source/drain contact(s), gate contact(s), and via(s) to theinterconnect stack. The interconnect stack contains multiple wiring (m1,m2, . . . ) layers, with vias (v1, v2, . . . ) between adjacent wiringlayers.

The vendor-independent layers of FIG. 8 can be readily mapped to thoseof commercial CMOS processes, such as GlobalFoundries (“GF”) (see U.S.Pat. Pub. Nos. US2014/0302660A1 and US2015/0170735A1 re the “GF layers”)or Taiwan Semiconductor Manufacturing Co. (“TSMC”) (see U.S. Pat. Pub.No. US2014/0210014A1 re the “TSMC layers”). Below is an exemplarymapping:

FIG. 8 layer GF layer TSMC layer gate (GATE) PC PO source/drain (AA) RXOD source/drain silicide (TS) TS M0_OD1 gate contact (GATECNT) CB M0_POsource/drain contact (AACNT) CA M0_OD2 via to interconnect stack (V0) V0Via0 first wiring layer (M1) M1 M1Indicated in parentheses are the names used to label these layers inFIGS. 10, 11, et seq. of this application. Persons skilled in the artwill realize that these represent a minority of the manylayers/masks/etc. used in the fabrication of modern devices.Nevertheless, these are believed to be the layers most relevant toenabling a skilled artisan to make and use the invention, and are thelayers traditionally depicted in patent drawings of semiconductorstructures (as shown, for example, by the cited GF and TSMCapplications). In certain instances, additional layers may be added todepictions of selected NCEM-enabled fill cells.

Persons skilled in the art will also understand that most of the abovelayers can—and often are—rendered in multiple patterning steps.Typically, in this application, the drawings will combine all exposuresinto a single depicted layer (e.g., M1=M1E1+M1E2, or M1E1+M1E2+M1E3). Inmost cases, such details are irrelevant to the operation of theinvention, and are determined largely by requirements of the fabricationprocess. In certain cases (e.g., anM1-M1-stitch-overlap-open-configured, NCEM-enabled fill cell), somepotentially relevant detail(s) may be obscured by the exposure merging;however, such obscured detail(s) will nonetheless be readily apparent tothe skilled artisan (by, for example, the fact that the named structure,e.g., M1-M1-stitch-overlap-open-configured, NCEM-enabled fill cell, mustcontain at least one overlap test region, as per FIG. 32, that isrendered in different exposures of M1, and located on the M1 pathbetween the NCEM pad and ground).

Furthermore, short-configured cells can exist in both “same color” and“different color” varieties. For example, in a process that usesmulti-patterned M1, the M1-tip-to-tip-configured, NCEM-enabled fillcells would come in two varieties:M1-tip-to-tip-same-color-short-configured cells, as well asM1-tip-to-tip-different-color-short-configured cells. The same appliesto other short configurations, such as side-to-side, diagonal, etc.

Reference is now made to FIGS. 9A-9E, which depict several illustrativedesigns for a NCEM pad, suitable for use in connection with embodimentsof the invention. Additional NCEM pads are disclosed in the incorporated'841 application. FIG. 9A shows a simple, solid conductive pad,typically, though not necessarily, formed in M1. FIGS. 9B-9D depictseveral options for a non-solid, segmented, single-conductor pad. (Aspersons skilled in the art will appreciate, the variety of shapes forsuch pads is endless.) FIG. 9E depicts an example of a presentlypreferred, multi-conductor, mesh-style pad. Applicants' experimentationhas revealed that these mesh-style pad designs—which are more spaceefficient and design rule friendly than single conductor pads—stillproduce a usable NCEM, particularly if sampled at low resolution, astaught in the incorporated '841 application. FIGS. 9F-9IIII depictadditional embodiments of mesh pad structures. As persons skilled in theart will appreciate, these structures can be rendered in any size (e.g.,2×2, 2×3, 3×2, 3×3, etc.), and not just the specifically depicted 10×9and 5×2 examples.

Design of the NCEM-enabled fill cells: Such fill cells preferably havecertain common elements (e.g., height, supply rails, and GATE pitch(CPP) that is consistent with standard cells in the library), then varyaccording to the measurement type, layer(s) involved, and structure(s)to be evaluated/tested. NCEM-enabled fill cells come in two basic types:short[/leakage] and open[/resistance]. Relevant layers typically involveeither a single process layer (e.g., GATE-to-GATE) or two process layers(e.g. GATECNT-to-GATE). Structural configurations are many, and includea set of standard structures (e.g., tip-to-tip, tip-to-side,side-to-side, etc.), as well as reference or ad hoc structures.

As depicted in FIGS. 10-11, the general structure of ashort[/leakage]-configured, NCEM-enabled fill cell preferably includesfour overlaid components: (i) “standard” patterning; (ii) a NCEM pad;(iii) “test gap” patterning; and (iv) pad/ground wiring. Standardpatterning is that which appears in essentially all of the standardlibrary cells, such as supply rails, and sometimes minimum contactedpoly pitch (CPP) spaced rail-to-rail GATE stripes, etc. The NCEM padscan take a variety of shapes/patterns, as is non-exhaustivelyexemplified in FIGS. 9A-9IIII. The standard structures used for test gappatterning are depicted in FIGS. 14-30, and may include tip-to-tip,tip-to-side, side-to-side, etc. (Note that a single, short-configuredNCEM-enabled fill cell may include more than one test gap, with all gapspreferably wired in parallel via the pad/ground wiring; an example withmultiple test gaps appears in FIG. 45). The pad/ground wiring compriseslow-resistance wiring from one side of the test gap(s) to the pad, andfrom the other side of the test gap(s) to a permanent or virtual ground.Points of effective ground include either supply rail, as well as anyelectrical structure that can conduct to the substrate under appropriatee-beam charging conditions (e.g., a p+ diode to NWELL that becomespositively charged during e-beam measurement). Virtual grounding can beaccomplished by connecting to a node with sufficient capacitance toavoid discharge during e-beam measurement, and thus act as a sourceand/or sink for electrons during the measurement.

As depicted in FIGS. 12-13, the general structure of anopen[/resistance]-configured, NCEM-enabled fill cell preferably includesfour overlaid components: (i) “standard” patterning; (ii) a NCEM pad;(iii) “test area” patterning; and (iv) pad/ground wiring. As with theshorts, standard patterning is that which appears in essentially all ofthe standard library cells, such as supply rails, etc. Similarly, theNCEM pads can take a variety of shapes/patterns, as is non-exhaustivelyexemplified in FIGS. 9A-9IIII. Standard structures used for teststructure patterning are depicted in FIGS. 28-36, and may include snake,overlap, stitch, etc. As with the shorts, the pad/ground wiring foropens comprises low-resistance wiring from one side of the teststructure patterning to the pad, and from the other side of the teststructure patterning to a permanent or virtual ground. Open-configured,NCEM-enabled fill cells can, and often do, include multiple test areas,in which case the pad/ground wiring connects all relevant teststructures in a series-connected chain.

In cases where the NCEM-enabled fill cells will be used with a highlyregular style cell library, an additional constraint on the NCEM-enabledfill cells is that they preferably conform, as closely as reasonablypossible, to the regular patterns used for the library's functionalcells. Preferred methods for measuring compliance with regular patterns,and/or constructing pattern-compliant cells, are described in U.S. Pat.Applic. Nos. 61/887,271 (“Template Based Design with LibAnalyzer”) and62/186,677 (“Template Based Design with LibAnalyzer”), both to Langneseet al., and both incorporated by reference herein. As those skilled inthe art will appreciate, close, if not perfect, pattern compliance isfeasible for those portions of the fill cell that do not affect thestructure(s) or fail mode(s) to be evaluated. In general, however,perfect pattern compliance will prove infeasible for a several reasons.First, the structure to-be-evaluated may not, itself, be an “allowable”pattern (e.g., the pattern rules for the library may not allow anystructure that spaces a GATE tip from a GATECNT side at minimum designrule dimensions, thus dictating that the“GATE-GATECNT-tip-to-side-short-configured, NCEM-enabled fill cell” willnecessarily include at least one pattern violation). Second, DOEstypically involve several small variations in at least oneminimum-spaced dimension, whereas regular patterning rules willtypically only permit one of the variants. And third, the patterningused for the NCEM pad is preferably selected to match the operationalcapabilities of the scanner, but may well violate the library's patternregularity constraints. Thus, ignoring these “necessary” patternregularity violations, NCEM-enabled fill cells for use with highlyregular libraries will preferably contain very few, if any, additionalpattern regularity violations.

Reference is now made to FIGS. 14-15, which depict plan views of twoexemplary test area geometries for tip-to-tip-short-configured,NCEM-enabled fill cells. Cells that utilize these geometricconfigurations may include:

-   -   AA-tip-to-tip-short-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 1298-1326];    -   AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 1327-1405];    -   AACNT-AA-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   AACNT-TS-tip-to-tip-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 1406-1412];    -   TS-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   GATE-tip-to-tip-short-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 1413-1461];    -   GATECNT-GATE-tip-to-tip-short-configured, NCEM-enabled fill        cells;    -   GATECNT-tip-to-tip-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 1462-1548];    -   GATECNT-AACNT-tip-to-tip-short-configured, NCEM-enabled fill        cells;    -   M1-tip-to-tip-short-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 1549-1556];    -   V0-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   M1-V0-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   V1-M1-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   V1-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   M2-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   M2-V1-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   V2-M2-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   M3-tip-to-tip-short-configured, NCEM-enabled fill cells;    -   V2-tip-to-tip-short-configured, NCEM-enabled fill cells; and,    -   M3-V2-tip-to-tip-short-configured, NCEM-enabled fill cells.    -   [As persons skilled in the art will understand, for interconnect        layers 2 and higher, any NCEM-enabled fill cell of type “M_(x) ⁻        . . . ” can also be formed as a corresponding “M_((x+n)) ⁻ . . .        ” cell, any “V_(x) ⁻ . . . ” cell can also be formed as a        corresponding “V_((x+n)) ⁻ . . . ” cell, any “M_(x)−V_((x+1)) ⁻        . . . ” cell can also be formed as a corresponding        “M_((x+n))−V_((x+n+1)) ⁻ . . . ” cell, and any “M_(x)−V_((x−1))        ⁻ . . . ” cell can also be formed as a corresponding        “M_((x+n))−V_((x+n−1)) ⁻ . . . ” cell, assuming that the        process-in-question supports the referenced interconnect layers.        The present description should be read as including all such        possible higher interconnect layer, and layer combination,        cells, in all available failure types and geometric        configurations.]        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g.,        lateral and/or gap dimension), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIG. 16, which depicts a plan view of exemplarytest area geometry for tip-to-side-short-configured, NCEM-enabled fillcells. Cells that utilize this geometric configuration may include:

-   -   AA-tip-to-side-short-configured, NCEM-enabled fill cells;    -   AACNT-tip-to-side-short-configured, NCEM-enabled fill cells        [e.g., FIG. 45];    -   AACNT-AA-tip-to-side-short-configured, NCEM-enabled fill cells;    -   GATE-AA-tip-to-side-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 49, 50, 1084-1119];    -   GATECNT-GATE-tip-to-side-short-configured, NCEM-enabled fill        cells [e.g., Parent FIGS. 1201-1238];    -   GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 1120-1149];    -   TS-GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 1239-1263];    -   GATECNT-AACNT-tip-to-side-short-configured, NCEM-enabled fill        cells [e.g., Parent FIGS. 1150-1188];    -   GATECNT-AACNT-TS-tip-to-side-short-configured, NCEM-enabled fill        cells [e.g., Parent FIGS. 1189-1200];    -   M1-tip-to-side-short-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 1264-1297];    -   V0-tip-to-side-short-configured, NCEM-enabled fill cells;    -   M1-V0-tip-to-side-short-configured, NCEM-enabled fill cells;    -   V1-M1-tip-to-side-short-configured, NCEM-enabled fill cells;    -   V1-tip-to-side-short-configured, NCEM-enabled fill cells;    -   M2-tip-to-side-short-configured, NCEM-enabled fill cells;    -   M2-V1-tip-to-side-short-configured, NCEM-enabled fill cells;    -   V2-M2-tip-to-side-short-configured, NCEM-enabled fill cells;    -   M3-tip-to-side-short-configured, NCEM-enabled fill cells;    -   V2-tip-to-side-short-configured, NCEM-enabled fill cells; and,    -   M3-V2-tip-to-side-short-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g.,        lateral and/or gap dimension), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIG. 17, which depicts a plan view of exemplarytest area geometry for side-to-side-short-configured, NCEM-enabled fillcells. Cells that utilize this geometric configuration may include:

-   -   AA-side-to-side-short-configured, NCEM-enabled fill cells;    -   AACNT-side-to-side-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 786-804];    -   AACNT-AA-side-to-side-short-configured, NCEM-enabled fill cells;    -   AACNT-GATE-side-to-side-short-configured, NCEM-enabled fill        cells [e.g., Parent FIGS. 805-832];    -   GATE-side-to-side-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 833-859];    -   GATECNT-GATE-side-to-side-short-configured, NCEM-enabled fill        cells [e.g., Parent FIGS. 886-903];    -   TS-GATE-side-to-side-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 937-1040];    -   GATECNT-side-to-side-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 860-872];    -   GATECNT-AACNT-side-to-side-short-configured, NCEM-enabled fill        cells [e.g., Parent FIGS. 47(a)-(c), and Parent FIGS. 873-885];    -   M1-side-to-side-short-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 904-928];    -   V0-side-to-side-short-configured, NCEM-enabled fill cells;    -   M1-V0-side-to-side-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 929-936];    -   V1-M1-side-to-side-short-configured, NCEM-enabled fill cells;    -   V1-side-to-side-short-configured, NCEM-enabled fill cells;    -   M2-side-to-side-short-configured, NCEM-enabled fill cells;    -   M2-V1-side-to-side-short-configured, NCEM-enabled fill cells;    -   V2-M2-side-to-side-short-configured, NCEM-enabled fill cells;    -   M3-side-to-side-short-configured, NCEM-enabled fill cells;    -   V2-side-to-side-short-configured, NCEM-enabled fill cells; and,    -   M3-V2-side-to-side-short-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g.,        lateral and/or gap dimension), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIGS. 18, 19, 20, 21, and 22, each of whichdepicts a plan view of exemplary test area geometry forL-shape-interlayer-short-configured, NCEM-enabled fill cells. Cells thatutilize these geometric configurations may include:

-   -   AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;    -   AACNT-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   AACNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   GATE-AA-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   GATE-TS-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   GATECNT-GATE-L-shape-interlayer-short-configured, NCEM-enabled        fill cells;    -   GATECNT-AA-L-shape-interlayer-short-configured, NCEM-enabled        fill cells;    -   GATECNT-TS-L-shape-interlayer-short-configured, NCEM-enabled        fill cells;    -   GATECNT-AACNT-L-shape-interlayer-short-configured, NCEM-enabled        fill cells;    -   V0-AA-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   V0-TS-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   V0-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   V0-GATE-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   V0-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled        fill cells;    -   M1-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   M1-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled        fill cells;    -   M1-V0-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   V1-M1-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   V1-V0-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   M2-M1-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   M2-V1-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   V2-V1-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   V2-M2-L-shape-interlayer-short-configured, NCEM-enabled fill        cells;    -   M3-M2-L-shape-interlayer-short-configured, NCEM-enabled fill        cells; and,    -   M3-V2-L-shape-interlayer-short-configured, NCEM-enabled fill        cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area, or by        varying other, same- or adjacent-layer patterning within the        expanded test area.

Reference is now made to FIG. 23, which depicts a plan view of exemplarytest area geometry for diagonal-short-configured, NCEM-enabled fillcells. Cells that utilize this geometric configuration may include:

-   -   AA-diagonal-short-configured, NCEM-enabled fill cells;    -   TS-diagonal-short-configured, NCEM-enabled fill cells;    -   AACNT-diagonal-short-configured, NCEM-enabled fill cells;    -   AACNT-AA-diagonal-short-configured, NCEM-enabled fill cells;    -   GATE-diagonal-short-configured, NCEM-enabled fill cells;    -   GATE-AACNT-diagonal-short-configured, NCEM-enabled fill cells;    -   GATECNT-GATE-diagonal-short-configured, NCEM-enabled fill cells;    -   GATECNT-diagonal-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 495-554];    -   GATECNT-AACNT-diagonal-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 555-632];    -   M1-diagonal-short-configured, NCEM-enabled fill cells;    -   V0-diagonal-short-configured, NCEM-enabled fill cells;    -   M1-V0-diagonal-short-configured, NCEM-enabled fill cells;    -   V1-M1-diagonal-short-configured, NCEM-enabled fill cells;    -   V1-diagonal-short-configured, NCEM-enabled fill cells;    -   M2-diagonal-short-configured, NCEM-enabled fill cells;    -   M2-V1-diagonal-short-configured, NCEM-enabled fill cells;    -   M3-diagonal-short-configured, NCEM-enabled fill cells;    -   V2-M2-diagonal-short-configured, NCEM-enabled fill cells;    -   V2-diagonal-short-configured, NCEM-enabled fill cells; and,    -   M3-V2-diagonal-short-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g., gap        dimension and/or gap angle), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIGS. 24, 25, and 26, each of which depicts aplan view of exemplary test area geometry for corner-short-configured,NCEM-enabled fill cells. These configurations differ from the diagonalconfiguration because, in these corner configurations, at least one ofthe first and/or second features is non-rectangular. Cells that utilizethese geometric configurations may include:

-   -   AA-corner-short-configured, NCEM-enabled fill cells;    -   AACNT-corner-short-configured, NCEM-enabled fill cells;    -   AACNT-AA-corner-short-configured, NCEM-enabled fill cells;    -   GATE-corner-short-configured, NCEM-enabled fill cells;    -   GATECNT-GATE-corner-short-configured, NCEM-enabled fill cells;    -   GATECNT-TS-corner-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 287-685];    -   GATECNT-corner-short-configured, NCEM-enabled fill cells;    -   GATECNT-AA-corner-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 263-286];    -   GATECNT-AACNT-corner-short-configured, NCEM-enabled fill cells;    -   M1-corner-short-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 416-494];    -   V0-corner-short-configured, NCEM-enabled fill cells;    -   M1-V0-corner-short-configured, NCEM-enabled fill cells;    -   V1-M1-corner-short-configured, NCEM-enabled fill cells;    -   V1-corner-short-configured, NCEM-enabled fill cells;    -   M2-corner-short-configured, NCEM-enabled fill cells;    -   M2-V1-corner-short-configured, NCEM-enabled fill cells;    -   M3-corner-short-configured, NCEM-enabled fill cells;    -   V2-M2-corner-short-configured, NCEM-enabled fill cells;    -   V2-corner-short-configured, NCEM-enabled fill cells; and,    -   M3-V2-corner-short-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g., gap        dimension and/or gap angle), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIG. 27, which depicts a plan view of exemplarytest area geometry for interlayer-overlap-short-configured, NCEM-enabledfill cells. Cells that utilize this geometric configuration may include:

-   -   GATE-AA-interlayer-overlap-short-configured, NCEM-enabled fill        cells [e.g., Parent FIGS. 692-734];    -   GATE-AACNT-interlayer-overlap-short-configured, NCEM-enabled        fill cells [e.g., Parent FIGS. 633-691];    -   GATE-TS-interlayer-overlap-short-configured, NCEM-enabled fill        cells;    -   GATECNT-TS-interlayer-overlap-short-configured, NCEM-enabled        fill cells;    -   GATECNT-AA-interlayer-overlap-short-configured, NCEM-enabled        fill cells;    -   V0-AA-interlayer-overlap-short-configured, NCEM-enabled fill        cells;    -   V0-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill        cells;    -   V0-TS-interlayer-overlap-short-configured, NCEM-enabled fill        cells;    -   V0-GATE-interlayer-overlap-short-configured, NCEM-enabled fill        cells;    -   M1-GATECNT-interlayer-overlap-short-configured, NCEM-enabled        fill cells;    -   M1-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill        cells;    -   V1-V0-interlayer-overlap-short-configured, NCEM-enabled fill        cells;    -   M2-M1-interlayer-overlap-short-configured, NCEM-enabled fill        cells;    -   V2-V1-interlayer-overlap-short-configured, NCEM-enabled fill        cells; and,    -   M3-M2-interlayer-overlap-short-configured, NCEM-enabled fill        cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g.,        major and/or minor dimension), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIG. 28, which depicts a plan view of exemplarytest area geometry for via-chamfer-short-configured, NCEM-enabled fillcells. Cells that utilize this geometric configuration may include:

-   -   V0-GATECNT-via-chamfer-short-configured, NCEM-enabled fill        cells;    -   V0-AACNT-via-chamfer-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 52-256];    -   V1-M1-via-chamfer-short-configured, NCEM-enabled fill cells;    -   V2-M2-via-chamfer-short-configured, NCEM-enabled fill cells;        and,    -   V3-M3-via-chamfer-short-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 257-262].        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g., gap        and/or lateral dimension), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIG. 29, which depicts a plan view of exemplarytest area geometry for merged-via-short-configured, NCEM-enabled fillcells. Cells that utilize this geometric configuration may include:

-   -   V0-merged-via-short-configured, NCEM-enabled fill cells;    -   V1-merged-via-short-configured, NCEM-enabled fill cells; and,    -   V2-merged-via-short-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g., gap        and/or lateral dimension), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIG. 30, which depicts a plan view of exemplarytest area geometry for snake-open-configured, NCEM-enabled fill cells.Cells that utilize this geometric configuration may include:

-   -   AA-snake-open-configured, NCEM-enabled fill cells;    -   TS-snake-open-configured, NCEM-enabled fill cells;    -   AACNT-snake-open-configured, NCEM-enabled fill cells;    -   GATE-snake-open-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 1041-1048];    -   GATECNT-snake-open-configured, NCEM-enabled fill cells;    -   V0-snake-open-configured, NCEM-enabled fill cells;    -   M1-snake-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 1049-1066];    -   M1-V0-AACNT-snake-open-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 1067-1071];    -   V1-snake-open-configured, NCEM-enabled fill cells;    -   M2-snake-open-configured, NCEM-enabled fill cells;    -   V2-snake-open-configured, NCEM-enabled fill cells; and,    -   M3-snake-open-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g.,        length, width, spacing, etc.), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIGS. 31-32, which each depict plan views ofexemplary test area geometries for stitch-open-configured, NCEM-enabledfill cells. Cells that utilize these geometric configurations mayinclude:

-   -   AA-stitch-open-configured, NCEM-enabled fill cells;    -   TS-stitch-open-configured, NCEM-enabled fill cells;    -   AACNT-stitch-open-configured, NCEM-enabled fill cells;    -   GATECNT-stitch-open-configured, NCEM-enabled fill cells;    -   V0-stitch-open-configured, NCEM-enabled fill cells;    -   M1-stitch-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 1072-1083];    -   V1-stitch-open-configured, NCEM-enabled fill cells;    -   M2-stitch-open-configured, NCEM-enabled fill cells;    -   V2-stitch-open-configured, NCEM-enabled fill cells; and,    -   M3-stitch-open-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g.,        major and/or minor dimension), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIG. 33, which depicts a plan view of exemplarytest area geometry for via-open-configured, NCEM-enabled fill cells.Cells that utilize this geometric configuration may include:

-   -   AACNT-TS-via-open-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 1629-1673];    -   AACNT-AA-via-open-configured, NCEM-enabled fill cells [Parent        FIGS. 1557-1628];    -   TS-AA-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2315-2330];    -   GATECNT-GATE-via-open-configured, NCEM-enabled fill cells [e.g.,        FIG. 48 and Parent FIGS. 1699-2005];    -   GATECNT-AACNT-via-open-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 1674-1682];    -   GATECNT-AACNT-GATE-via-open-configured, NCEM-enabled fill cells        [e.g., Parent FIGS. 1683-1698];    -   V0-GATECNT-via-open-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 2375-2439];    -   V0-AA-via-open-configured, NCEM-enabled fill cells;    -   V0-TS-via-open-configured, NCEM-enabled fill cells;    -   V0-AACNT-via-open-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 2345-2374];    -   V0-GATE-via-open-configured, NCEM-enabled fill cells;    -   V0-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2331-2344];    -   M1-V0-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2006-2200];    -   V1-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2440-2441];    -   V1-M1-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2442-2459];    -   V1-M2-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2221-2256];    -   M1-GATECNT-via-open-configured, NCEM-enabled fill cells;    -   M1-AANCT-via-open-configured, NCEM-enabled fill cells;    -   V2-M2-via-open-configured, NCEM-enabled fill cells;    -   M3-V2-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2257-2274];    -   V3-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2460-2461];    -   M4-V3-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2275-2296]; and,    -   M5-V4-via-open-configured, NCEM-enabled fill cells [e.g., Parent        FIGS. 2297-2314].        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g.,        upper extension, lower extension, and/or via size/shape), or by        varying other, same- or adjacent-layer patterning within the        expanded test area.

Reference is now made to FIGS. 34 and 35, which respectively depict planand cross-sectional views of exemplary test area geometry formetal-island-open-configured, NCEM-enabled fill cells. Cells thatutilize this geometric configuration may include:

-   -   M1-metal-island-open-configured, NCEM-enabled fill cells;    -   M2-metal-island-open-configured, NCEM-enabled fill cells; and,    -   M3-metal-island-open-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g.,        major extension, minor extension, and/or size(s)/shape(s) of        lower and/or upper stacked vias), or by varying other, same- or        adjacent-layer patterning within the expanded test area.

Reference is now made to FIG. 36, which depicts a plan view of exemplarytest area geometry for merged-via-open-configured, NCEM-enabled fillcells. Cells that utilize this geometric configuration may include:

-   -   V0-merged-via-open-configured, NCEM-enabled fill cells [e.g.,        Parent FIGS. 735-785];    -   V0-AACNT-merged-via-open-configured, NCEM-enabled fill cells;    -   V0-GATECNT-merged-via-open-configured, NCEM-enabled fill cells;    -   V1-merged-via-open-configured, NCEM-enabled fill cells;    -   V2-merged-via-open-configured, NCEM-enabled fill cells;    -   V1-M1-merged-via-open-configured, NCEM-enabled fill cells; and,    -   V2-M2-merged-via-open-configured, NCEM-enabled fill cells.        DOEs of these structures are preferably constructed by varying        the dimensional parameters that define the test area (e.g., gap        dimension, lateral dimension, and/or size/shape of one or both        vias), or by varying other, same- or adjacent-layer patterning        within the expanded test area.

Reference is now made to FIG. 37, which shows exemplary expanded testarea geometry from a 1^(st) variant of a NCEM-enabled fill cell, and toFIG. 38, which shows exemplary expanded test area geometry from a 2^(nd)variant of a NCEM-enabled fill cell. These figures, and the two thatfollow, illustrate the computation of the PSR between (the depictedlayer, which could be any layer, of) the 1^(st) variant and the 2^(nd)variant. FIG. 39 shows the logical AND of (depicted layer) patterningwithin both expanded test areas (of FIGS. 37 & 38). FIG. 40 shows thelogical OR of patterning within both expanded test areas (of FIGS. 37 &38). The PSR (pattern similarity ratio) is then defined as the arearatio of the AND patterns to the OR patterns. Conceptually, PSR is ameasure of how much of the patterning within the common expanded testareas is new. In other words, if the two cells are identical (within thelayer(s)-at-issue, and within the common expanded test area), then thePSR will be 1.0. Conversely, if they share no common patterning (withinthe layer(s)-at-issue, and within the common expanded test area), thenthe AND patterns will be nil, and the PSR will be 0.0.

Reference is now made to FIG. 41, which depicts an exemplary processflow, suitable for use in connection with certain embodiments of theinvention. At FF1, an initial set of product masks is produced (orotherwise obtained); these initial product masks include a firstcollection of NCEM-enabled fill cells.

At FF2, processing of wafers is initiated using the initial productmasks. Such processing preferably includes at least FEOL and/or MOLprocessing, but may also include BEOL processing. Before FF3, NCEMmeasurements are preferably obtained from some or all of theNCEM-enabled fill cells on the partially-processed initial productwafers.

At FF3, some or all of the obtained NCEM measurements are “used” tocontinue processing of the initial product wafers. Such “use” mayinclude determining whether to continue or abandon processing of one ormore of the wafers, modifying one or more processing, inspection ormetrology steps in the continued processing of one or more of the wafers(and/or other product wafers currently being manufactured using processflows relevant to observed manufacturing failures), and/or performingadditional processing, metrology or inspection steps on one or more ofthe wafers (and/or other product wafers currently being manufacturedusing process flows relevant to observed manufacturing failures).

At FF4, final product masks are produced (or otherwise obtained) “using”at least some of the NCEM measurements obtained during the processing ofinitial product wafers. Here, such “use” preferably includes selectingand instantiating a second collection of NCEM-enabled fill cells that isbetter and/or optimally matched to failure modes observed duringprocessing of the initial product wafers. For example, if the firstcollection of NCEM-enabled fill cells includedGATE-side-to-side-short-configured cells, yet no GATE side-to-sideshorts were observed during processing of the initial product wafers,then the second collection of NCEM-enabled fill cells would preferablyomit GATE-side-to-side-short-configured cells, and instead replace themwith other NCEM-enabled fill cells that are better matched to theobserved or expected failure modes on the final product wafers.

At FF5, processing of wafers is initiated using the final product masks.Such processing preferably includes at least FEOL and/or MOL processing,but may also include BEOL processing. Before FF6, NCEM measurements arepreferably obtained from some or all of the NCEM-enabled fill cells onthe partially-processed final product wafers.

At FF6, some or all of the obtained NCEM measurements are “used” tocontinue processing of the final product wafers. Such “use” may includedetermining whether to continue or abandon processing of one or more ofthe wafers, modifying one or more processing, inspection or metrologysteps in the continued processing of one or more of the wafers (and/orother product wafers currently being manufactured using process flowsrelevant to observed manufacturing failures), and/or performingadditional processing, metrology or inspection steps on one or more ofthe wafers (and/or other product wafers currently being manufacturedusing process flows relevant to observed manufacturing failures).

Reference is now made to FIG. 42, which depicts an exemplary processflow for obtaining and (optionally) using measurements from mesh-styleNCEM pads. As persons skilled in the art will appreciate, this processcan be utilized either with or without NCEM-enabled fill cells; in otherwords, the mesh-style NCEM pads can be instantiated within NCEM-enabledfill cells, but can also be instantiated anywhere on a chip, die, orwafer. Furthermore, as persons skilled in the art will also appreciate,the order of steps FF7 & FF8 can be reversed, or performedsimultaneously, to accommodate processes where the order of AACNT &GATECNT patterning is different.

Reference is now made to FIG. 43, which depicts another exemplaryprocess flow, suitable for use in accordance with certain embodiments ofthe invention. At GG1, test mask (e.g., masks to produce a “test” or“engineering” wafer) are produced or otherwise obtained; such test masksinclude a first collection of NCEM-enabled fill cells.

At GG2, processing of the test wafer(s) is initiated. Such processingpreferably includes FEOL and/or MOL processing, but may also includeBEOL processing.

At GG3, NCEM measurements are obtained from NCEM-enabled fill cells onthe partially-processed test wafer(s).

At GG4, the obtained measurements are “used” to select a secondcollection of NCEM-enabled fill cells (preferably a subset of the firstcollection) for instantiation on product wafers. Here, such “use”preferably includes selecting a second collection of NCEM-enabled fillcells that, given the available fill cell space on the product wafers,is optimally matched to failure modes observed during processing of thetest product wafers. For example, if the first collection ofNCEM-enabled fill cells included GATE-side-to-side-short-configuredcells, yet no GATE side-to-side shorts were observed during processingof test wafers, then the second collection of NCEM-enabled fill cellswould preferably omit GATE-side-to-side-short-configured cells.

At GG5, product masks that include the second collection of NCEM-enabledfill cells are produced, or otherwise obtained.

At GG6, processing of the product wafer(s) is initiated. Such processingpreferably includes at least FEOL and/or MOL processing, but may alsoinclude BEOL processing. Prior to GG7, NCEM measurements are obtainedfrom at least some of the NCEM-enabled fill cells on thepartially-processed product wafer(s).

At GG7, some or all of the obtained NCEM measurements are “used” tocontinue processing of the product wafer(s). Such “use” may includedetermining whether to continue or abandon processing of one or more ofthe product wafers, modifying one or more processing, inspection ormetrology steps in the continued processing of one or more of theproduct wafers (and/or other product wafers currently being manufacturedusing process flows relevant to observed manufacturing failures), and/orperforming additional processing, metrology or inspection steps on oneor more of the product wafers (and/or other product wafers currentlybeing manufactured using process flows relevant to observedmanufacturing failures).

In certain embodiments, FF1-3 and/or GG5-7 could be practiced asstand-alone process flows.

Reference is now made to FIG. 44, which depicts a plan view of anexemplary M1-snake-open-configured, NCEM-enabled fill cell. This cellcontains a left-facing-E-shaped NCEM pad, a snake-open-configured testarea, and is NCEM-enabled to detect the following failure mode: M1 snakeopen. In the depicted configuration, a passing response is groundedmetal=bright NCEM, whereas a failing response is floating pad=dark NCEM.

Reference is now made to FIG. 45, which depicts a plan view of anexemplary AACNT-tip-to-side-short-configured, NCEM-enabled fill cell.This cell contains four test areas, and an E-shaped NCEM pad thatoverlies the test areas. It is NC-configured for inline measurement ofthe following failure mode: AACNT tip-to-side short. In the depictedconfiguration, a passing response is floating AA contacts=dark NCEM,whereas a failing response is a short to grounded contact layer=brightNCEM.

Reference is now made to FIGS. 46A-C, which respectively depict planviews of—(A) all layers; (B) NWELL, AA, GATE, GATECNT, TS, and AACNTlayers; (C) V0 and M1 layers—of an exemplaryTS-GATE-side-to-side-short-configured, NCEM-enabled fill cell of typePDF_D_VCI_V16_14S1_01. This cell utilizes a composite NCEM pad, asdepicted in FIG. 9E.

Reference is now made to FIGS. 47A-C, which respectively depict planviews of—(A) all layers; (B) NWELL, AA, GATE, GATECNT, TS, and AACNTlayers; (C) V0 and M1 layers—of an exemplaryGATECNT-AACNT-side-to-side-short-configured, NCEM-enabled fill cell oftype PDF_D_VCI_V16_14S1_05. This cell also utilizes a composite NCEMpad.

Reference is now made to FIGS. 48A-C, which respectively depict planviews of—(A) all layers; (B) NWELL, AA, GATE, GATECNT, TS, and AACNTlayers; (C) V0 and M1 layers—of an exemplaryGATECNT-GATE-via-open-configured, NCEM-enabled fill cell of typePDF_D_VCI_V16_14S1_08. This cell also utilizes a composite NCEM pad.

Reference is now made to FIGS. 49A-C, which respectively depict planviews of—(A) all layers; (B) NWELL, AA, GATE, GATECNT, TS, and AACNTlayers; (C) V0 and M1 layers—of an exemplaryGATE-AA-tip-to-side-short-configured, NCEM-enabled fill cell of typePDF_D_VCI_V16_14S1_11. This cell also utilizes a composite NCEM pad.

Reference is now made to FIGS. 50(A)-(C), which respectively depict planviews of—(A) all layers; (B) NWELL, AA, GATE, GATECNT, TS, and AACNTlayers; (C) V0 and M1 layers—of another exemplaryGATE-AA-tip-to-side-short-configured, NCEM-enabled fill cell of typePDF_D_VCI_V16_14S1_12. This cell also utilizes a composite NCEM pad.

Parent FIGS. 2345-2347 depict three variants of the same cell. ParentFIGS. 2346(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2348-2350 depict three variants of the same cell. ParentFIGS. 2349(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2351-2353 depict three variants of the same cell. ParentFIGS. 2351(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2354-2356 depict three variants of the same cell. ParentFIGS. 2354(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2357-2359 depict three variants of the same cell. ParentFIGS. 2358(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2360-2362 depict three variants of the same cell. ParentFIGS. 2361(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2363-2365 depict three variants of the same cell. ParentFIGS. 2364(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2366-2368 depict three variants of the same cell. ParentFIGS. 2367(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2369-2371 depict three variants of the same cell. ParentFIGS. 2370(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2372-2374 depict three variants of the same cell. ParentFIGS. 2373(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2375-2377 depict three variants of the same cell. ParentFIGS. 2376(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2378-2380 depict three variants of the same cell. ParentFIGS. 2379(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2381-2383 depict three variants of the same cell. ParentFIGS. 2382(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2384-2386 depict three variants of the same cell. ParentFIGS. 2385(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2387-2389 depict three variants of the same cell. ParentFIGS. 2388(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2390-2392 depict three variants of the same cell. ParentFIGS. 2391(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2399-2401 depict three variants of the same cell. ParentFIGS. 2399(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2402-2403 depict two variants of the same cell. The figureset represents intentionally misaligned conditions.

Parent FIGS. 2404-2406 depict three variants of the same cell. ParentFIGS. 2405(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2407-2409 depict three variants of the same cell. ParentFIGS. 2408(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2410-2412 depict three variants of the same cell. ParentFIGS. 2411(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2413-2415 depict three variants of the same cell. ParentFIGS. 2414(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2416-2418 depict three variants of the same cell. ParentFIGS. 2417(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2419-2421 depict three variants of the same cell. ParentFIGS. 2420(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2422-2424 depict three variants of the same cell. ParentFIGS. 2423(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2425-2427 depict three variants of the same cell. ParentFIGS. 2426(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2428-2430 depict three variants of the same cell. ParentFIGS. 2429(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2431-2433 depict three variants of the same cell. ParentFIGS. 2432(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2434-2436 depict three variants of the same cell. ParentFIGS. 2435(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2437-2439 depict three variants of the same cell. ParentFIGS. 2438(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2442-2444 depict three variants of the same cell. ParentFIGS. 2443(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2445-2447 depict three variants of the same cell. ParentFIGS. 2446(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2448-2450 depict three variants of the same cell. ParentFIGS. 2449(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2451-2453 depict three variants of the same cell. ParentFIGS. 2452(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2454-2456 depict three variants of the same cell. ParentFIGS. 2455(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 2457-2459 depict three variants of the same cell. ParentFIGS. 2458(A)-(C) show the nominal case, whereas the other figuresrepresent intentionally misaligned conditions.

Parent FIGS. 203-223, 236-286, 389-397, 404-409, 485-494, 546-548,552-554, 621-632, 682, 691, 731-734, 762-785, 848-859, 880-903,1014-1040, 1096-1119, 1189-1200, 1222-1224, 1234-1238, 1249-1263,1543-1548, 1687-1698, 1870-1872, 1876-1881, 1885-1902, 1912-1947,1954-1980, 1984-1993, 2003-2005, 2157-2314, 2343-2344, 2357-2374, and2404-2461 show depictions of NCEM-enabled fill cells without NCEM pads.Persons skilled in the art will understand that pads of any design(e.g., FIGS. 9A-9IIII, etc.) would be added, either at the left edgewith a corresponding leftward extension of the supply rails, oroverlying or partially overlying the depicted portion of the cells.

Certain of the claims that follow may contain one or moremeans-plus-function limitations of the form, “a <cell name> means forenabling NC detection of a GATE-tip-to-tip short.” It is applicant'sintent that such limitations be construed, pursuant to 35 U.S.C.§112(f), as “the structure of the named cell, or an equivalentstructure, that enables detection of a GATE-tip-to-tip short bynon-contact measurement.”

Additionally, certain of the claims that follow may contain one or morestep-plus-function limitations of the form, “a <cell name> step forenabling NC detection of a GATE-tip-to-tip short.” It is applicant'sintent that such limitations be construed, pursuant to 35 U.S.C.§112(f), as “enabling voltage contrast detection of a GATE-tip-to-tipshort by patterning an instance of the named cell, or an equivalentcell.”

While the invention has been illustrated with respect to one or morespecific implementations, numerous alterations and/or modifications canbe made to the illustrated examples without departing from the spiritand scope of the appended claims. In addition, while a particularfeature of the invention may have been disclosed with respect to onlyone of several implementations, such feature may be combined with one ormore other features of the other implementations as may be desired andadvantageous for any given or particular application. Furthermore, tothe extent that the terms “including,” “includes,” “having,” “has,”“with,” or variants thereof are used in either the detailed descriptionor the claims, such terms are intended to be inclusive in a mannersimilar to the term “comprising.” As used herein, the phrase “Xcomprises one or more of A, B, and C” means that X can include any ofthe following: either A, B, or C alone; or combinations of two, such asA and B, B and C, and A and C; or combinations of three A, B and C.

What we claim in this application is:
 1. A method for making integratedcircuits (ICs), comprising at least: (a) performing initial processingsteps to produce a test wafer that includes a first Design ofExperiments (DOE) of Non-Contact Electrical Measurement (NCEM)-enabled,via to interconnect stack (V0)-via-open-configured fill cells, saidinitial processing steps including: (i) patterning, on the test wafer, afirst means for enabling non-contact (NC) detection of V0 via opens;and, (ii) patterning, on the test wafer, a second means for enabling NCdetection of V0 via opens; wherein the first and second means forenabling NC detection of V0 via opens are different; (b) determining apresence or absence of V0 via opens on the test wafer by: performing avoltage contrast examination of NCEM-enabled fill cells in the firstDOE, including at least the first and second means for enabling NCdetection of V0 via opens; and, (c) using the results from step (b) toselect NCEM-enabled fill cells for inclusion on a subsequent productwafer.
 2. A method for making ICs, as defined in claim 1, wherein step(c) includes: selecting, for inclusion on the product wafer, a pluralityof NCEM-enabled, V0-via-open-configured fill cells, if step (b)indicated a presence of any V0 via opens.
 3. A method for making ICs, asdefined in claim 1, wherein step (c) includes: omitting, from inclusionon the product wafer, any NCEM-enabled, V0-via-open-configured fillcells, if step (b) indicated an absence of any V0 via opens.
 4. A methodfor making ICs, as defined in claim 1, wherein the first and secondmeans for enabling NC detection of V0 via opens are both selected fromthe list consisting of: a I_PDF_VCI_FILL08_19S2000194 means for enablingNC detection of V0 via opens; a I_PDF_VCI_FILL12_19S2000294 means forenabling NC detection of V0 via opens; and, aI_PDF_VCI_FILL16_19S2000394 means for enabling NC detection of V0 viaopens.
 5. A method for making ICs, as defined in claim 1, wherein thefirst and second means for enabling NC detection of V0 via opens areboth selected from the list consisting of: a I_PDF_VCI_FILL08_19S2000494means for enabling NC detection of V0 via opens; aI_PDF_VCI_FILL12_19S2000594 means for enabling NC detection of V0 viaopens; and, a I_PDF_VCI_FILL16_19S2000694 means for enabling NCdetection of V0 via opens.
 6. A method for making ICs, as defined inclaim 1, wherein the first and second means for enabling NC detection ofV0 via opens are both selected from the list consisting of: aI_PDF_VCI_FILL08_19S2000794 means for enabling NC detection of V0 viaopens; a I_PDF_VCI_FILL12_19S2000B94 means for enabling NC detection ofV0 via opens; and, a I_PDF_VCI_FILL16_19S2000994 means for enabling NCdetection of V0 via opens.
 7. A method for making ICs, as defined inclaim 1, wherein the first and second means for enabling NC detection ofV0 via opens are both selected from the list consisting of: aI_PDF_VCI_FILL08_19S2000A94 means for enabling NC detection of V0 viaopens; a I_PDF_VCI_FILL12_19S2000B94 means for enabling NC detection ofV0 via opens; and, a I_PDF_VCI_FILL16_19S2000C94 means for enabling NCdetection of V0 via opens.
 8. A method for making ICs, as defined inclaim 1, wherein the first and second means for enabling NC detection ofV0 via opens are both selected from the list consisting of: aK_V549_PDF_VCI_3000153_01 means for enabling NC detection of V0 viaopens; and, a V54C_M_PDF_VCI_3000153_01 means for enabling NC detectionof V0 via opens.
 9. A method for making ICs, as defined in claim 1,wherein step (a) further includes patterning at least three additionalfill cells selected from the list consisting of:AA-tip-to-tip-short-configured, NCEM-enabled fill cells;AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells;AACNT-AA-tip-to-tip-short-configured, NCEM-enabled fill cells;TS-tip-to-tip-short-configured, NCEM-enabled fill cells;GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-tip-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V0-tip-to-tip-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-tip-short-configured, NCEM-enabled fill cells;V1-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-tip-to-tip-short-configured, NCEM-enabled fill cells;V2-tip-to-tip-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-tip-short-configured, NCEM-enabled fill cells;AA-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATE-AA-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;TS-GATECNT-tip-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-tip-to-side-short-configured, NCEM-enabled fill cells;M1-tip-to-side-short-configured, NCEM-enabled fill cells;V0-tip-to-side-short-configured, NCEM-enabled fill cells;M1-V0-tip-to-side-short-configured, NCEM-enabled fill cells;V1-M1-tip-to-side-short-configured, NCEM-enabled fill cells;V1-tip-to-side-short-configured, NCEM-enabled fill cells;M2-tip-to-side-short-configured, NCEM-enabled fill cells;M2-V1-tip-to-side-short-configured, NCEM-enabled fill cells;V2-M2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-tip-to-side-short-configured, NCEM-enabled fill cells;V2-tip-to-side-short-configured, NCEM-enabled fill cells;M3-V2-tip-to-side-short-configured, NCEM-enabled fill cells;AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-AA-side-to-side-short-configured, NCEM-enabled fill cells;AACNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-GATE-side-to-side-short-configured, NCEM-enabled fill cells;TS-GATE-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-side-to-side-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-side-to-side-short-configured, NCEM-enabled fill cells;M1-side-to-side-short-configured, NCEM-enabled fill cells;V0-side-to-side-short-configured, NCEM-enabled fill cells;M1-V0-side-to-side-short-configured, NCEM-enabled fill cells;V1-M1-side-to-side-short-configured, NCEM-enabled fill cells;V1-side-to-side-short-configured, NCEM-enabled fill cells;M2-side-to-side-short-configured, NCEM-enabled fill cells;M2-V1-side-to-side-short-configured, NCEM-enabled fill cells;V2-M2-side-to-side-short-configured, NCEM-enabled fill cells;M3-side-to-side-short-configured, NCEM-enabled fill cells;V2-side-to-side-short-configured, NCEM-enabled fill cells;M3-V2-side-to-side-short-configured, NCEM-enabled fill cells;AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-L-shape-interlayer-short-configured, NCEM-enabled fill cells;AACNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-AA-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATE-TS-L-shape-interlayer-short-configured, NCEM-enabled fill cells;GATECNT-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; GATECNT-AACNT-L-shape-interlayer-short-configured, NCEM-enabledfill cells; V0-AA-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-TS-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATE-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V0-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-AACNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-GATECNT-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V1-V0-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-M1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-V1-L-shape-interlayer-short-configured, NCEM-enabled fillcells; V2-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-M2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; M3-V2-L-shape-interlayer-short-configured, NCEM-enabled fillcells; AA-diagonal-short-configured, NCEM-enabled fill cells;TS-diagonal-short-configured, NCEM-enabled fill cells;AACNT-diagonal-short-configured, NCEM-enabled fill cells;AACNT-AA-diagonal-short-configured, NCEM-enabled fill cells;GATE-diagonal-short-configured, NCEM-enabled fill cells;GATE-AACNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-GATE-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-diagonal-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-diagonal-short-configured, NCEM-enabled fill cells;M1-diagonal-short-configured, NCEM-enabled fill cells;V0-diagonal-short-configured, NCEM-enabled fill cells;M1-V0-diagonal-short-configured, NCEM-enabled fill cells;V1-M1-diagonal-short-configured, NCEM-enabled fill cells;V1-diagonal-short-configured, NCEM-enabled fill cells;M2-diagonal-short-configured, NCEM-enabled fill cells;M2-V1-diagonal-short-configured, NCEM-enabled fill cells;M3-diagonal-short-configured, NCEM-enabled fill cells;V2-M2-diagonal-short-configured, NCEM-enabled fill cells;V2-diagonal-short-configured, NCEM-enabled fill cells;M3-V2-diagonal-short-configured, NCEM-enabled fill cells;AA-corner-short-configured, NCEM-enabled fill cells;AACNT-corner-short-configured, NCEM-enabled fill cells;AACNT-AA-corner-short-configured, NCEM-enabled fill cells;GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-GATE-corner-short-configured, NCEM-enabled fill cells;GATECNT-TS-corner-short-configured, NCEM-enabled fill cells;GATECNT-corner-short-configured, NCEM-enabled fill cells;GATECNT-AACNT-corner-short-configured, NCEM-enabled fill cells;M1-corner-short-configured, NCEM-enabled fill cells;V0-corner-short-configured, NCEM-enabled fill cells;M1-V0-corner-short-configured, NCEM-enabled fill cells;V1-M1-corner-short-configured, NCEM-enabled fill cells;V1-corner-short-configured, NCEM-enabled fill cells;M2-corner-short-configured, NCEM-enabled fill cells;M2-V1-corner-short-configured, NCEM-enabled fill cells;M3-corner-short-configured, NCEM-enabled fill cells;V2-M2-corner-short-configured, NCEM-enabled fill cells;V2-corner-short-configured, NCEM-enabled fill cells;M3-V2-corner-short-configured, NCEM-enabled fill cells;GATE-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATE-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;GATECNT-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AA-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-TS-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATE-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-GATECNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;M1-AACNT-interlayer-overlap-short-configured, NCEM-enabled fill cells;V1-V0-interlayer-overlap-short-configured, NCEM-enabled fill cells;M2-M1-interlayer-overlap-short-configured, NCEM-enabled fill cells;V2-V1-interlayer-overlap-short-configured, NCEM-enabled fill cells;M3-M2-interlayer-overlap-short-configured, NCEM-enabled fill cells;V0-GATECNT-via-chamfer-short-configured, NCEM-enabled fill cells;V0-AACNT-via-chamfer-short-configured, NCEM-enabled fill cells;V1-M1-via-chamfer-short-configured, NCEM-enabled fill cells;V2-M2-via-chamfer-short-configured, NCEM-enabled fill cells;V0-merged-via-short-configured, NCEM-enabled fill cells;V1-merged-via-short-configured, NCEM-enabled fill cells;V2-merged-via-short-configured, NCEM-enabled fill cells;AA-snake-open-configured, NCEM-enabled fill cells;TS-snake-open-configured, NCEM-enabled fill cells;AACNT-snake-open-configured, NCEM-enabled fill cells;GATE-snake-open-configured, NCEM-enabled fill cells;GATECNT-snake-open-configured, NCEM-enabled fill cells;V0-snake-open-configured, NCEM-enabled fill cells;M1-snake-open-configured, NCEM-enabled fill cells;V1-snake-open-configured, NCEM-enabled fill cells;M2-snake-open-configured, NCEM-enabled fill cells;V2-snake-open-configured, NCEM-enabled fill cells;M3-snake-open-configured, NCEM-enabled fill cells;AA-stitch-open-configured, NCEM-enabled fill cells;TS-stitch-open-configured, NCEM-enabled fill cells;AACNT-stitch-open-configured, NCEM-enabled fill cells;GATECNT-stitch-open-configured, NCEM-enabled fill cells;V0-stitch-open-configured, NCEM-enabled fill cells;M1-stitch-open-configured, NCEM-enabled fill cells;V1-stitch-open-configured, NCEM-enabled fill cells;M2-stitch-open-configured, NCEM-enabled fill cells;V2-stitch-open-configured, NCEM-enabled fill cells;M3-stitch-open-configured, NCEM-enabled fill cells;AACNT-TS-via-open-configured, NCEM-enabled fill cells;AACNT-AA-via-open-configured, NCEM-enabled fill cells;TS-AA-via-open-configured, NCEM-enabled fill cells;GATECNT-AACNT-via-open-configured, NCEM-enabled fill cells;GATECNT-AACNT-GATE-via-open-configured, NCEM-enabled fill cells;GATECNT-GATE-via-open, NCEM-enabled fill cells;V0-GATECNT-via-open-configured, NCEM-enabled fill cells;V0-AA-via-open-configured, NCEM-enabled fill cells;V0-TS-via-open-configured, NCEM-enabled fill cells;V0-AACNT-via-open-configured, NCEM-enabled fill cells;V0-GATE-via-open-configured, NCEM-enabled fill cells;M1-V0-via-open-configured, NCEM-enabled fill cells;V1-M1-via-open-configured, NCEM-enabled fill cells;V1-M2-via-open-configured, NCEM-enabled fill cells;M1-GATECNT-via-open-configured, NCEM-enabled fill cells;M1-AANCT-via-open-configured, NCEM-enabled fill cells;V2-M2-via-open-configured, NCEM-enabled fill cells;M3-V2-via-open-configured, NCEM-enabled fill cells;M1-metal-island-open-configured, NCEM-enabled fill cells;M2-metal-island-open-configured, NCEM-enabled fill cells;M3-metal-island-open-configured, NCEM-enabled fill cells;V0-merged-via-open-configured, NCEM-enabled fill cells;V0-AACNT-merged-via-open-configured, NCEM-enabled fill cells;V0-GATECNT-merged-via-open-configured, NCEM-enabled fill cells;V1-merged-via-open-configured, NCEM-enabled fill cells;V2-merged-via-open-configured, NCEM-enabled fill cells;V1-M1-merged-via-open-configured, NCEM-enabled fill cells; and,V2-M2-merged-via-open-configured, NCEM-enabled fill cells.
 10. A methodfor making ICs, comprising at least: (a) performing initial processingsteps to produce a test wafer that includes a first DOE of NCEM-enabled,V0-via-open-configured fill cells, said initial processing stepsincluding: (i) patterning, on the test wafer, a first means for enablingNC detection of V0 via opens; and, (ii) patterning, on the test wafer, asecond means for enabling NC detection of V0 via opens; wherein thefirst and second means for enabling NC detection of V0 via opens aredifferent; (b) determining a presence or absence of V0 via opens on thetest wafer by: performing a voltage contrast examination of NCEM-enabledfill cells in the first DOE, including at least the first and secondmeans for enabling NC detection of V0 via opens; and, (c) using theresults from step (b) in processing of a subsequent product wafer.